MC9S08GT32CFDER

MC9S08GT32CFDER

Manufacturer No:

MC9S08GT32CFDER

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 32KB FLASH 48QFN

Datasheet:

Datasheet

Delivery:

Payment:

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MC9S08GT32CFDER Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-QFN-EP (7x7)
  • Package / Case
    48-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    1.8V ~ 3.6V
  • RAM Size
    2K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (32K x 8)
  • Number of I/O
    39
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    I²C, SCI, SPI
  • Speed
    40MHz
  • Core Size
    8-Bit
  • Core Processor
    S08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    S08
The MB9AF116NAPMC-G-JNE2 is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High-performance: The MB9AF116NAPMC-G-JNE2 chip is designed to deliver high-performance processing capabilities, making it suitable for applications that require fast and efficient data processing. 2. Low power consumption: This chip is designed to be energy-efficient, making it suitable for battery-powered devices or applications where power consumption is a concern. 3. Integrated peripherals: The chip comes with various integrated peripherals such as UART, I2C, SPI, timers, and ADC, which can simplify the design and reduce the need for external components. 4. Rich memory options: The chip offers a range of memory options, including Flash memory and SRAM, allowing for flexible storage and data handling capabilities. 5. Robust security features: The chip includes security features such as a hardware encryption engine and a random number generator, making it suitable for applications that require data security.Application scenarios: 1. Industrial automation: The high-performance and integrated peripherals of the chip make it suitable for industrial automation applications such as motor control, robotics, and factory automation. 2. Internet of Things (IoT): The low power consumption and integrated peripherals make the chip suitable for IoT applications such as smart home devices, wearable devices, and sensor nodes. 3. Consumer electronics: The chip's high-performance processing capabilities and memory options make it suitable for various consumer electronics applications such as gaming consoles, multimedia devices, and home appliances. 4. Automotive electronics: The chip's robustness, security features, and integrated peripherals make it suitable for automotive applications such as engine control units, dashboard systems, and advanced driver-assistance systems (ADAS). 5. Medical devices: The chip's low power consumption, integrated peripherals, and security features make it suitable for medical devices such as patient monitoring systems, portable medical devices, and diagnostic equipment.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or application. It is recommended to consult the datasheet and technical documentation provided by the manufacturer for detailed information on the chip's capabilities and suitability for specific applications.