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MC9S08GT32CFBER

MC9S08GT32CFBER

Manufacturer No:

MC9S08GT32CFBER

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 32KB FLASH 44QFP

Datasheet:

Datasheet

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MC9S08GT32CFBER Specifications

  • Type
    Parameter
  • Supplier Device Package
    44-QFP (10x10)
  • Package / Case
    44-QFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    1.8V ~ 3.6V
  • RAM Size
    2K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (32K x 8)
  • Number of I/O
    36
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    I²C, SCI, SPI
  • Speed
    40MHz
  • Core Size
    8-Bit
  • Core Processor
    S08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    S08
The UPD70F3556AM1GMA1-GBK-AX integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The UPD70F3556AM1GMA1-GBK-AX chips are designed to deliver high performance with a 32-bit RISC CPU core, capable of executing instructions at high speeds. 2. Low Power Consumption: These chips are designed to operate at low power, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Rich Peripherals: The chips come with a wide range of built-in peripherals such as timers, UART, I2C, SPI, ADC, and PWM, which provide flexibility and ease of integration into various applications. 4. Ample Memory: The chips have a large on-chip memory, including flash memory for program storage and RAM for data storage, enabling the execution of complex algorithms and data processing tasks. 5. Enhanced Security: The chips offer security features like memory protection units, code flash security, and data flash security, ensuring the safety and integrity of the stored data and program code.Application Scenarios: 1. Industrial Automation: The UPD70F3556AM1GMA1-GBK-AX chips can be used in industrial automation systems for controlling and monitoring various processes, such as robotics, motor control, and sensor interfacing. 2. Automotive Electronics: These chips find applications in automotive electronics, including engine control units (ECUs), body control modules (BCMs), and dashboard displays, due to their high performance, low power consumption, and security features. 3. Consumer Electronics: The chips can be used in consumer electronics devices like smart appliances, home automation systems, and wearable devices, where low power consumption, high performance, and security are essential. 4. Medical Devices: The chips can be utilized in medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices, where real-time processing, data storage, and security are critical. 5. Internet of Things (IoT): The UPD70F3556AM1GMA1-GBK-AX chips can be integrated into IoT devices, enabling connectivity, data processing, and control in smart homes, smart cities, and industrial IoT applications.Overall, the UPD70F3556AM1GMA1-GBK-AX integrated circuit chips offer high performance, low power consumption, rich peripherals, ample memory, and enhanced security, making them suitable for a wide range of applications in various industries.
MC9S08GT32CFBER Relevant information