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MC56F8367VVFE

MC56F8367VVFE

Manufacturer No:

MC56F8367VVFE

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16B 512KB FLASH 160MAPBGA

Datasheet:

Datasheet

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MC56F8367VVFE Specifications

  • Type
    Parameter
  • Supplier Device Package
    160-MAPBGA (15x15)
  • Package / Case
    160-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 16x12b
  • Voltage - Supply (Vcc/Vdd)
    2.25V ~ 3.6V
  • RAM Size
    18K x 16
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    512KB (256K x 16)
  • Number of I/O
    76
  • Peripherals
    POR, PWM, Temp Sensor, WDT
  • Connectivity
    CANbus, EBI/EMI, SCI, SPI
  • Speed
    60MHz
  • Core Size
    16-Bit
  • Core Processor
    56800E
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    56F8xxx
The MM908E626AVPEK is an integrated circuit chip developed by NXP Semiconductors. It is specifically designed for automotive applications and offers several advantages and application scenarios. Some of them include:1. Enhanced Connectivity: The chip provides enhanced connectivity options, including LIN (Local Interconnect Network) and CAN (Controller Area Network) interfaces. This allows for seamless communication and integration with other automotive systems.2. Robust Performance: The MM908E626AVPEK chip is designed to operate in harsh automotive environments, with a wide temperature range and high immunity to electromagnetic interference (EMI). It ensures reliable performance even in challenging conditions.3. Low Power Consumption: The chip is optimized for low power consumption, making it suitable for battery-powered automotive applications. It helps in reducing energy consumption and extending the overall battery life.4. Integrated Features: The MM908E626AVPEK chip integrates various features, such as a microcontroller unit (MCU), analog and digital peripherals, and memory. This integration simplifies the design process and reduces the overall component count, leading to cost savings and improved reliability.5. Automotive Applications: The chip is primarily used in automotive applications, including body control modules, lighting systems, HVAC (Heating, Ventilation, and Air Conditioning) systems, and other control units. It enables efficient and reliable control of various functions within a vehicle.6. Diagnostic Capabilities: The MM908E626AVPEK chip supports onboard diagnostics, allowing for real-time monitoring and troubleshooting of automotive systems. It helps in identifying and rectifying faults, improving maintenance and repair processes.7. Scalability: The chip offers scalability options, allowing for easy customization and adaptation to different automotive applications. It can be configured to meet specific requirements, making it suitable for a wide range of vehicle models and designs.Overall, the MM908E626AVPEK integrated circuit chip provides enhanced connectivity, robust performance, low power consumption, and integrated features for automotive applications. Its advantages and application scenarios make it a reliable choice for various control and monitoring functions within vehicles.
MC56F8367VVFE Relevant information