P89LV51RD2BN,112

P89LV51RD2BN,112

Manufacturer No:

P89LV51RD2BN,112

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 64KB FLASH 40DIP

Datasheet:

Datasheet

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P89LV51RD2BN,112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    40-DIP
  • Package / Case
    40-DIP (0.600", 15.24mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 3.6V
  • RAM Size
    1K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    64KB (64K x 8)
  • Number of I/O
    32
  • Peripherals
    Brown-out Detect/Reset, POR, PWM, WDT
  • Connectivity
    SPI, UART/USART
  • Speed
    33MHz
  • Core Size
    8-Bit
  • Core Processor
    8051
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    89LV
The CYUSB3011-BZXC is an integrated circuit chip developed by Cypress Semiconductor. It is a USB 3.0 peripheral controller that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the CYUSB3011-BZXC chip are:Advantages: 1. USB 3.0 Compliance: The chip is compliant with the USB 3.0 specification, providing high-speed data transfer rates of up to 5 Gbps. 2. Low Power Consumption: It is designed to consume low power, making it suitable for applications where power efficiency is crucial. 3. Integrated Features: The chip integrates various features like a USB 3.0 PHY, a USB 2.0 PHY, a USB 3.0 controller, and a general-purpose I/O interface, reducing the need for additional components. 4. Flexible Configuration: It offers flexible configuration options, allowing customization based on specific application requirements. 5. Software Development Kit (SDK): Cypress provides an SDK for the chip, enabling developers to easily implement USB 3.0 functionality in their applications.Application Scenarios: 1. External Storage Devices: The CYUSB3011-BZXC chip can be used in external hard drives, solid-state drives (SSDs), or USB flash drives to provide high-speed data transfer capabilities. 2. High-Speed Data Acquisition: It can be utilized in data acquisition systems that require fast data transfer rates, such as high-resolution cameras or scientific instruments. 3. Video Streaming: The chip can be employed in video capture devices or video streaming applications that demand high bandwidth for real-time video transmission. 4. Industrial Automation: It can be integrated into industrial automation systems to enable high-speed communication between devices, such as industrial cameras or control modules. 5. Medical Devices: The chip can be used in medical devices that require high-speed data transfer, such as medical imaging systems or patient monitoring devices.These are just a few examples of the advantages and application scenarios of the CYUSB3011-BZXC integrated circuit chip. Its versatility and USB 3.0 compatibility make it suitable for a wide range of applications that require high-speed data transfer capabilities.