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P89LPC9401FBD,551

P89LPC9401FBD,551

Manufacturer No:

P89LPC9401FBD,551

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 8KB FLASH 64LQFP

Datasheet:

Datasheet

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P89LPC9401FBD,551 Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-LQFP (14x14)
  • Package / Case
    64-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    2.4V ~ 3.6V
  • RAM Size
    256 x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    8KB (8K x 8)
  • Number of I/O
    23
  • Peripherals
    Brown-out Detect/Reset, LCD, LED, POR, PWM, WDT
  • Connectivity
    I²C, SPI, UART/USART
  • Speed
    18MHz
  • Core Size
    8-Bit
  • Core Processor
    8051
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    LPC900
The STMP3750XXBBEA5N integrated circuit chips, also known as the STMP3750 series, are highly integrated multimedia application processors designed for portable multimedia devices. Here are some advantages and application scenarios of these chips:Advantages: 1. High Integration: The STMP3750 series chips offer a high level of integration, combining multiple functions and peripherals into a single chip. This reduces the overall system complexity and cost. 2. Multimedia Capabilities: These chips are specifically designed for multimedia applications, offering advanced audio and video processing capabilities. They support various audio and video formats, enabling high-quality multimedia playback. 3. Low Power Consumption: The STMP3750 series chips are optimized for low power consumption, making them suitable for battery-powered portable devices. They incorporate power management features to maximize battery life. 4. Connectivity Options: These chips provide various connectivity options, including USB, Ethernet, and wireless interfaces like Wi-Fi and Bluetooth. This enables seamless connectivity with other devices and networks. 5. Rich Development Ecosystem: The STMP3750 series chips are supported by a rich development ecosystem, including software development kits (SDKs) and development tools. This simplifies the development process and accelerates time-to-market.Application Scenarios: 1. Portable Media Players: The STMP3750 series chips are commonly used in portable media players, enabling high-quality audio and video playback on the go. They support various media formats and provide a user-friendly interface. 2. Digital Cameras: These chips can be used in digital cameras to enable advanced image and video processing capabilities. They support high-resolution image sensors and offer features like image stabilization and face detection. 3. E-Readers: The STMP3750 series chips can power e-readers, providing a rich multimedia experience for reading digital books and magazines. They support e-ink displays and offer features like touch input and wireless connectivity. 4. Portable Gaming Devices: These chips can be utilized in portable gaming devices, enabling immersive gaming experiences. They offer advanced graphics processing capabilities and support various gaming engines. 5. Internet of Things (IoT) Devices: The STMP3750 series chips can be integrated into IoT devices, providing multimedia capabilities and connectivity options. They can power smart home devices, wearables, and other IoT applications.Overall, the STMP3750XXBBEA5N integrated circuit chips offer high integration, multimedia capabilities, low power consumption, and connectivity options, making them suitable for a wide range of portable multimedia devices and IoT applications.
P89LPC9401FBD,551 Relevant information