MC68376BGMAB20

MC68376BGMAB20

Manufacturer No:

MC68376BGMAB20

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 160QFP

Datasheet:

Datasheet

Delivery:

Payment:

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MC68376BGMAB20 Specifications

  • Type
    Parameter
  • Supplier Device Package
    160-QFP (28x28)
  • Package / Case
    160-BQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 16x10b
  • Voltage - Supply (Vcc/Vdd)
    4.75V ~ 5.25V
  • RAM Size
    7.5K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    18
  • Peripherals
    POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, SCI, SPI
  • Speed
    20MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    CPU32
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    M683xx
The RG82875 is an integrated circuit chip developed by Intel Corporation. It is specifically designed for server applications and offers several advantages and application scenarios:1. High Performance: The RG82875 chip is built with advanced technology and features multiple cores, high clock speeds, and large cache sizes. This enables it to deliver exceptional performance for demanding server workloads.2. Scalability: The chip supports multi-socket configurations, allowing for scalability in server systems. This means that multiple RG82875 chips can be used together to create powerful and scalable server platforms.3. Reliability and Availability: The RG82875 chip incorporates various reliability features, such as error-correcting code (ECC) memory support, which helps in detecting and correcting memory errors. It also supports advanced server management technologies, ensuring high availability and system reliability.4. Virtualization Support: The chip includes hardware-assisted virtualization technologies, such as Intel Virtualization Technology (VT-x), which enhances the performance and efficiency of virtualized server environments. This makes it suitable for virtualization scenarios, where multiple virtual machines need to run simultaneously.5. Data Center Optimization: The RG82875 chip is designed to optimize data center operations. It offers features like Intel QuickAssist Technology, which accelerates cryptographic and compression workloads, and Intel Data Direct I/O Technology, which improves I/O performance by reducing latency and increasing bandwidth.6. Cloud Computing: With its high performance and scalability, the RG82875 chip is well-suited for cloud computing environments. It can handle the demanding workloads of cloud applications and support the rapid provisioning and scaling of resources.7. Big Data Analytics: The chip's processing power and advanced features make it ideal for big data analytics applications. It can efficiently handle large datasets and perform complex computations required for data analysis.Overall, the RG82875 integrated circuit chip offers high performance, scalability, reliability, and advanced features, making it suitable for a wide range of server applications, including virtualization, cloud computing, data centers, and big data analytics.