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MC9S08RC60FJE

MC9S08RC60FJE

Manufacturer No:

MC9S08RC60FJE

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 60KB FLASH 32LQFP

Datasheet:

Datasheet

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MC9S08RC60FJE Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-LQFP (7x7)
  • Package / Case
    32-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    1.8V ~ 3.6V
  • RAM Size
    2K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    60KB (60K x 8)
  • Number of I/O
    25
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    SCI
  • Speed
    8MHz
  • Core Size
    8-Bit
  • Core Processor
    S08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    S08
The UPD70F3558AM2GMA1-GBK-AX integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: The chips are designed to deliver high performance with a 32-bit RISC CPU core, allowing for fast and efficient processing. 2. Low power consumption: The chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Rich peripheral functions: The chips come with a wide range of built-in peripheral functions such as timers, serial interfaces, analog-to-digital converters, and more, providing flexibility and reducing the need for external components. 4. Enhanced security features: The chips offer various security features like memory protection, encryption, and tamper detection, making them suitable for applications that require data security. 5. Wide operating temperature range: The chips can operate reliably in a wide temperature range, making them suitable for industrial applications.Application scenarios: 1. Industrial automation: The chips can be used in industrial automation systems for controlling and monitoring various processes, thanks to their high performance, low power consumption, and wide operating temperature range. 2. Automotive electronics: The chips can be used in automotive applications such as engine control units, dashboard systems, and safety systems, benefiting from their high performance, low power consumption, and security features. 3. Consumer electronics: The chips can be used in various consumer electronics devices like home appliances, gaming consoles, and audio/video equipment, leveraging their high performance and low power consumption. 4. Internet of Things (IoT): The chips can be used in IoT devices for data processing, connectivity, and security, thanks to their low power consumption, rich peripheral functions, and security features. 5. Medical devices: The chips can be used in medical devices like patient monitoring systems, diagnostic equipment, and medical imaging devices, benefiting from their high performance, low power consumption, and security features.Overall, the UPD70F3558AM2GMA1-GBK-AX integrated circuit chips offer a combination of high performance, low power consumption, rich peripheral functions, and security features, making them suitable for a wide range of applications in various industries.
MC9S08RC60FJE Relevant information