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MC9S08RC32FJE

MC9S08RC32FJE

Manufacturer No:

MC9S08RC32FJE

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 32KB FLASH 32LQFP

Datasheet:

Datasheet

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MC9S08RC32FJE Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-LQFP (7x7)
  • Package / Case
    32-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    1.8V ~ 3.6V
  • RAM Size
    2K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (32K x 8)
  • Number of I/O
    25
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    SCI
  • Speed
    8MHz
  • Core Size
    8-Bit
  • Core Processor
    S08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    S08
The MB89663RPF-GT-141-BNDE1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a 32-bit RISC CPU core operating at a high clock frequency. 2. Low Power Consumption: The chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Rich Peripherals: They come with a wide range of built-in peripherals such as UART, I2C, SPI, timers, and PWM, providing flexibility for various applications. 4. Enhanced Security: The chips offer security features like a hardware random number generator and a memory protection unit, ensuring data integrity and protection against unauthorized access. 5. Ample Memory: They have a large on-chip memory, including flash memory for program storage and RAM for data storage, enabling the execution of complex applications.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for controlling and monitoring processes, thanks to their high performance, low power consumption, and rich peripheral support. 2. Internet of Things (IoT): With their low power consumption and security features, these chips are suitable for IoT devices such as smart home appliances, wearables, and environmental sensors. 3. Consumer Electronics: They can be utilized in various consumer electronic devices like gaming consoles, multimedia players, and home entertainment systems, benefiting from their high performance and ample memory. 4. Automotive Electronics: The chips can be employed in automotive applications such as engine control units, dashboard systems, and infotainment systems, leveraging their robustness, security features, and peripheral support. 5. Medical Devices: These chips can be used in medical devices like patient monitoring systems, portable diagnostic devices, and medical imaging equipment, taking advantage of their low power consumption, high performance, and security features.Overall, the MB89663RPF-GT-141-BNDE1 integrated circuit chips offer a combination of high performance, low power consumption, rich peripherals, and security features, making them suitable for a wide range of applications in various industries.
MC9S08RC32FJE Relevant information