MC9S08RC32CFJE
Manufacturer No:
MC9S08RC32CFJE
Manufacturer:
Description:
IC MCU 8BIT 32KB FLASH 32LQFP
Datasheet:
Delivery:
![](/static/public/images/DHL.png)
![](/static/public/images/TNT.webp)
![](/static/public/images/UPS.png)
![](/static/public/images/FedEx.png)
![](/static/public/images/SF-Express.webp)
Payment:
![](/static/public/images/paypal.png)
![](/static/public/images/paypal02.png)
![](/static/public/images/paypal03.png)
![](/static/public/images/paypal04.png)
In Stock : 0
Please send RFQ , we will respond immediately.
![](/static/public/images/kenko_Certif02.png)
![](/static/public/images/kenko_Certif07.png)
![](/static/public/images/kenko_Certif03.png)
![](/static/public/images/kenko_Certif04.png)
![](/static/public/images/kenko_Certif08.png)
![](/static/public/images/kenko_Certif10.png)
![](/static/public/images/kenko_Certif09.png)
![](/static/public/images/kenko_Certif05.png)
![](/static/public/images/kenko_Certif06.png)
MC9S08RC32CFJE Specifications
-
TypeParameter
-
Supplier Device Package32-LQFP (7x7)
-
Package / Case32-LQFP
-
Mounting TypeSurface Mount
-
Operating Temperature-40°C ~ 85°C (TA)
-
Oscillator TypeInternal
-
Data Converters-
-
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V
-
RAM Size2K x 8
-
EEPROM Size-
-
Program Memory TypeFLASH
-
Program Memory Size32KB (32K x 8)
-
Number of I/O25
-
PeripheralsLVD, POR, PWM, WDT
-
ConnectivitySCI
-
Speed8MHz
-
Core Size8-Bit
-
Core ProcessorS08
-
DigiKey ProgrammableNot Verified
-
PackagingTray
-
Product StatusObsolete
-
SeriesS08
The MB89663RPF-G-202-BNDE1 is a specific model of integrated circuit chip manufactured by Fujitsu. While I couldn't find detailed information about this specific chip, I can provide you with some general advantages and application scenarios of integrated circuit chips.Advantages of integrated circuit chips: 1. Miniaturization: Integrated circuit chips allow for the miniaturization of electronic devices, making them smaller and more portable. 2. Cost-effective: Integrated circuit chips can be mass-produced, leading to lower production costs compared to discrete components. 3. Reliability: Integrated circuit chips are less prone to failure due to their compact design and reduced number of interconnections. 4. Power efficiency: Integrated circuit chips are designed to be power-efficient, helping to conserve energy in electronic devices. 5. Versatility: Integrated circuit chips can be designed for various applications, making them versatile for use in different electronic devices.Application scenarios of integrated circuit chips: 1. Consumer electronics: Integrated circuit chips are widely used in consumer electronics such as smartphones, tablets, laptops, televisions, and gaming consoles. 2. Automotive industry: Integrated circuit chips are used in various automotive applications, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). 3. Industrial automation: Integrated circuit chips are utilized in industrial automation systems for control and monitoring purposes. 4. Medical devices: Integrated circuit chips are used in medical devices like pacemakers, MRI machines, and blood glucose monitors. 5. Communication systems: Integrated circuit chips are essential components in communication systems, including routers, modems, and wireless devices.It's important to note that the specific advantages and application scenarios of the MB89663RPF-G-202-BNDE1 chip may vary depending on its specifications and intended use. For detailed information about this chip, it is recommended to refer to the manufacturer's datasheet or technical documentation.
MC9S08RC32CFJE Relevant information
-
LM3S8538-IQC50-A2
Texas Instruments -
LM3S1937-IQC50-A2
Texas Instruments -
LM3S1637-IQC50-A2
Texas Instruments -
LM3S1635-IQC50-A2
Texas Instruments -
LM3S1332-IQC50-A2
Texas Instruments -
LM3S1165-IQC50-A2
Texas Instruments -
LM3S1162-IQC50-A2
Texas Instruments -
LM3S1133-IQC50-A2
Texas Instruments -
LM3S308-IQN25
Texas Instruments -
P89LPC936FA,529
NXP USA Inc.