MC908MR8MDWE

MC908MR8MDWE

Manufacturer No:

MC908MR8MDWE

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 8KB FLASH 28SOIC

Datasheet:

Datasheet

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MC908MR8MDWE Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SOIC
  • Package / Case
    28-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 4x10b
  • Voltage - Supply (Vcc/Vdd)
    4.5V ~ 5.5V
  • RAM Size
    256 x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    8KB (8K x 8)
  • Number of I/O
    12
  • Peripherals
    LVD, POR, PWM
  • Connectivity
    SCI
  • Speed
    8MHz
  • Core Size
    8-Bit
  • Core Processor
    HC08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    HC08
The M308B8SGP is a specific model of integrated circuit (IC) chip manufactured by Renesas Electronics. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for the M308B8SGP:Advantages: 1. High Performance: The M308B8SGP is designed to deliver high-performance computing capabilities, making it suitable for applications that require fast and efficient processing. 2. Low Power Consumption: This IC chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Compact Size: The M308B8SGP is a compact IC chip, which makes it suitable for applications where space is limited or miniaturization is required. 4. Integrated Peripherals: The chip integrates various peripherals such as timers, serial interfaces, analog-to-digital converters (ADCs), and more, reducing the need for additional external components and simplifying the overall system design. 5. Wide Operating Temperature Range: The M308B8SGP is designed to operate reliably across a wide temperature range, making it suitable for applications that require operation in harsh environments.Application Scenarios: 1. Industrial Automation: The M308B8SGP can be used in industrial automation systems for tasks such as control, monitoring, and data processing. Its high performance and integrated peripherals make it suitable for applications like programmable logic controllers (PLCs), motor control, and sensor interfacing. 2. Automotive Electronics: The chip's low power consumption, compact size, and wide operating temperature range make it suitable for automotive applications. It can be used in areas such as engine control units (ECUs), body control modules (BCMs), and infotainment systems. 3. Consumer Electronics: The M308B8SGP can be utilized in various consumer electronic devices, including smart home devices, wearable technology, and portable devices. Its compact size and low power consumption make it suitable for applications like smartwatches, fitness trackers, and home automation systems. 4. Medical Devices: The chip's high performance and low power consumption make it suitable for medical devices that require real-time processing and low energy consumption. It can be used in applications such as patient monitoring systems, medical imaging, and diagnostic equipment.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the M308B8SGP chip, and it is always recommended to refer to the manufacturer's documentation and guidelines for accurate information.