P89LPC906FD,112

P89LPC906FD,112

Manufacturer No:

P89LPC906FD,112

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 1KB FLASH 8SO

Datasheet:

Datasheet

Delivery:

Payment:

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P89LPC906FD,112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SO
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    2.4V ~ 3.6V
  • RAM Size
    128 x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    1KB (1K x 8)
  • Number of I/O
    6
  • Peripherals
    Brown-out Detect/Reset, LED, POR, WDT
  • Connectivity
    -
  • Speed
    18MHz
  • Core Size
    8-Bit
  • Core Processor
    8051
  • DigiKey Programmable
    Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    LPC900
The NET+50-QINP-3 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The chips are designed to deliver high performance and efficiency, making them suitable for demanding applications. 2. Low Power Consumption: These chips are optimized for low power consumption, making them ideal for battery-powered devices or energy-efficient applications. 3. Compact Size: The chips are designed to be compact, allowing for easy integration into small form factor devices. 4. Secure Communication: The chips support secure communication protocols, ensuring the confidentiality and integrity of data transmission. 5. Scalability: The chips offer scalability options, allowing for easy customization and adaptation to different application requirements. 6. Cost-Effective: These chips provide a cost-effective solution for various applications, making them suitable for mass production.Application Scenarios: 1. Internet of Things (IoT): The chips can be used in IoT devices for secure and efficient communication between devices and the cloud. 2. Smart Home Automation: These chips can be integrated into smart home devices, enabling secure and reliable communication between different devices and the central control system. 3. Industrial Automation: The chips can be used in industrial automation systems for real-time communication between sensors, actuators, and control systems. 4. Wearable Devices: These chips can be utilized in wearable devices such as smartwatches or fitness trackers, enabling low-power and secure communication with smartphones or other devices. 5. Automotive Applications: The chips can be integrated into automotive systems for secure communication between different components, such as sensors, control units, and infotainment systems. 6. Medical Devices: These chips can be used in medical devices for secure and efficient communication between devices and healthcare systems, ensuring patient data privacy and integrity.Overall, the NET+50-QINP-3 integrated circuit chips offer high performance, low power consumption, and secure communication capabilities, making them suitable for a wide range of applications in various industries.