P89LPC902FD,112

P89LPC902FD,112

Manufacturer No:

P89LPC902FD,112

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 1KB FLASH 8SO

Datasheet:

Datasheet

Delivery:

Payment:

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P89LPC902FD,112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SO
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    2.4V ~ 3.6V
  • RAM Size
    128 x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    1KB (1K x 8)
  • Number of I/O
    6
  • Peripherals
    Brown-out Detect/Reset, LED, POR, WDT
  • Connectivity
    -
  • Speed
    7.3728MHz
  • Core Size
    8-Bit
  • Core Processor
    8051
  • DigiKey Programmable
    Verified
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    LPC900
The NET+50-BINP integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. High Performance: The NET+50-BINP chips are designed to provide high-performance computing capabilities, enabling faster processing and improved efficiency. 2. Energy Efficiency: These chips are optimized for energy efficiency, consuming less power while delivering high computational power. This makes them suitable for applications where power consumption is a concern. 3. Scalability: The chips are designed to be highly scalable, allowing for easy integration into different systems and applications. 4. Versatility: NET+50-BINP chips can be used in a wide range of applications, from data centers and cloud computing to artificial intelligence and machine learning.Application Scenarios: 1. Data Centers: These chips can be used in data centers to enhance the processing capabilities and improve the overall performance of servers and networking equipment. 2. Artificial Intelligence (AI): NET+50-BINP chips can be utilized in AI applications, such as deep learning and neural networks, to accelerate the training and inference processes. 3. Edge Computing: With their energy-efficient design, these chips are suitable for edge computing scenarios where low power consumption is crucial, such as IoT devices and smart sensors. 4. High-Performance Computing: The high-performance capabilities of NET+50-BINP chips make them ideal for applications that require intensive computational tasks, such as scientific simulations, weather forecasting, and financial modeling. 5. Autonomous Vehicles: These chips can be used in autonomous vehicles to process large amounts of data in real-time, enabling advanced driver assistance systems and autonomous driving capabilities.Overall, the NET+50-BINP integrated circuit chips offer advantages in terms of performance, energy efficiency, scalability, and versatility, making them suitable for a wide range of applications in various industries.