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LPC2290FBD144,551

LPC2290FBD144,551

Manufacturer No:

LPC2290FBD144,551

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16/32BIT ROMLESS 144LQFP

Datasheet:

Datasheet

Delivery:

Payment:

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LPC2290FBD144,551 Specifications

  • Type
    Parameter
  • Supplier Device Package
    144-LQFP (20x20)
  • Package / Case
    144-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    1.65V ~ 3.6V
  • RAM Size
    16K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    76
  • Peripherals
    PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
  • Speed
    60MHz
  • Core Size
    16/32-Bit
  • Core Processor
    ARM7®
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bag
  • Product Status
    Obsolete
  • Series
    LPC2200
The NET+40-QINRO-4 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to provide high-performance networking capabilities, enabling fast and efficient data processing. 2. Integration: They integrate multiple functions and features into a single chip, reducing the need for additional components and simplifying the overall system design. 3. Power Efficiency: The chips are designed to be power-efficient, helping to reduce energy consumption and extend battery life in portable devices. 4. Scalability: They offer scalability options, allowing for easy integration into various networking systems and applications. 5. Security: The chips provide built-in security features, ensuring secure data transmission and protecting against potential threats.Application Scenarios: 1. Networking Equipment: The NET+40-QINRO-4 chips can be used in networking equipment such as routers, switches, and gateways to enhance their performance and functionality. 2. Internet of Things (IoT): These chips can be integrated into IoT devices to enable seamless connectivity and efficient data processing, facilitating the exchange of information between devices. 3. Industrial Automation: They can be utilized in industrial automation systems to enable reliable and high-speed communication between different components and devices. 4. Smart Home: The chips can be integrated into smart home devices, enabling efficient networking and communication between various devices and systems within a smart home ecosystem. 5. Telecommunications: They can be used in telecommunications infrastructure, such as base stations and network servers, to enhance network performance and enable faster data transmission.Overall, the NET+40-QINRO-4 integrated circuit chips offer high-performance networking capabilities, integration, power efficiency, scalability, and security, making them suitable for various applications in networking, IoT, industrial automation, smart home, and telecommunications.
LPC2290FBD144,551 Relevant information