LPC2131FBD64,151

LPC2131FBD64,151

Manufacturer No:

LPC2131FBD64,151

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16/32BIT 32KB FLSH 64LQFP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

LPC2131FBD64,151 Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-LQFP (10x10)
  • Package / Case
    64-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b; D/A 1x10b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 3.6V
  • RAM Size
    8K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (32K x 8)
  • Number of I/O
    47
  • Peripherals
    Brown-out Detect/Reset, POR, PWM, WDT
  • Connectivity
    I²C, Microwire, SPI, SSI, SSP, UART/USART
  • Speed
    60MHz
  • Core Size
    16/32-Bit
  • Core Processor
    ARM7®
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    LPC2100
The MM912G634DV2APR2 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High integration: The MM912G634DV2APR2 chips integrate multiple functions into a single chip, reducing the need for external components and simplifying the overall design. 2. Low power consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered applications. 3. Robust communication: The chips support various communication protocols, such as LIN (Local Interconnect Network) and CAN (Controller Area Network), enabling reliable and efficient data transfer. 4. Enhanced safety features: The chips incorporate safety mechanisms like voltage monitoring, watchdog timers, and fault detection, ensuring the safe operation of the system. 5. Automotive-grade quality: The MM912G634DV2APR2 chips are specifically designed for automotive applications, meeting the stringent quality and reliability requirements of the automotive industry.Application Scenarios: 1. Automotive Body Control Modules (BCM): These chips can be used in BCMs to control various functions like lighting, door locks, windows, and mirrors in a vehicle. 2. Automotive Climate Control Systems: The chips can be employed in climate control systems to regulate temperature, fan speed, and air distribution in a vehicle's cabin. 3. Automotive Seat Control Modules: These chips can be utilized in seat control modules to manage seat adjustments, heating, and ventilation functions. 4. Automotive Lighting Systems: The chips can be integrated into lighting systems to control headlights, taillights, turn signals, and interior lighting in a vehicle. 5. Automotive Access Systems: The chips can be used in keyless entry systems, enabling secure and convenient access to vehicles.Overall, the MM912G634DV2APR2 integrated circuit chips offer a range of advantages and find applications in various automotive systems, enhancing functionality, efficiency, and safety.