P89LPC935FDH,529

P89LPC935FDH,529

Manufacturer No:

P89LPC935FDH,529

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 8KB FLASH 28TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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P89LPC935FDH,529 Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-TSSOP
  • Package / Case
    28-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x8b; D/A 2x8b
  • Voltage - Supply (Vcc/Vdd)
    2.4V ~ 3.6V
  • RAM Size
    768 x 8
  • EEPROM Size
    512 x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    8KB (8K x 8)
  • Number of I/O
    26
  • Peripherals
    Brown-out Detect/Reset, LED, POR, PWM, WDT
  • Connectivity
    I²C, SPI, UART/USART
  • Speed
    12MHz
  • Core Size
    8-Bit
  • Core Processor
    8051
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    LPC900
The PEF21512EV1.2 integrated circuit chip is a highly versatile and advanced chip that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the PEF21512EV1.2 chip are:1. High Performance: The chip is designed to deliver high performance and efficiency, making it suitable for demanding applications that require fast data processing and transmission.2. Broadband Communication: The PEF21512EV1.2 chip is specifically designed for broadband communication systems, enabling high-speed data transmission over various communication networks.3. Flexibility: The chip offers a high degree of flexibility, allowing it to be used in different communication systems and protocols, such as Ethernet, DSL, and wireless networks.4. Integration: The PEF21512EV1.2 chip integrates multiple functions into a single chip, reducing the need for additional components and simplifying the overall system design.5. Power Efficiency: The chip is designed to be power-efficient, helping to reduce energy consumption and extend the battery life of devices in which it is used.6. Telecommunication Infrastructure: The PEF21512EV1.2 chip can be applied in telecommunication infrastructure, such as routers, switches, and access points, to enable high-speed data transmission and efficient network management.7. Industrial Automation: The chip can be used in industrial automation systems, providing reliable and high-performance communication capabilities for data exchange between various devices and control systems.8. Internet of Things (IoT): With its broadband communication capabilities and power efficiency, the PEF21512EV1.2 chip can be utilized in IoT devices, enabling seamless connectivity and efficient data transfer in IoT networks.9. Smart Grids: The chip can be applied in smart grid systems, facilitating efficient communication between power generation, distribution, and consumption devices, enabling better monitoring and control of the electrical grid.Overall, the PEF21512EV1.2 integrated circuit chip offers high performance, flexibility, and power efficiency, making it suitable for a wide range of applications in the field of communication systems, industrial automation, IoT, and smart grids.