P80C31SBPN,112

P80C31SBPN,112

Manufacturer No:

P80C31SBPN,112

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT ROMLESS 40DIP

Datasheet:

Datasheet

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P80C31SBPN,112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    40-DIP
  • Package / Case
    40-DIP (0.600", 15.24mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 5.5V
  • RAM Size
    128 x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    32
  • Peripherals
    POR
  • Connectivity
    UART/USART
  • Speed
    16MHz
  • Core Size
    8-Bit
  • Core Processor
    8051
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    80C
The UPD703380GJA-196-GAE-SES-AX integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a clock frequency of up to 196 MHz, making them suitable for demanding applications. 2. Low Power Consumption: The chips are optimized for low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Integrated Peripherals: The chips come with various integrated peripherals such as UART, I2C, SPI, timers, and GPIOs, reducing the need for external components and simplifying the overall system design. 4. Large Memory Capacity: These chips have a large memory capacity, including flash memory for program storage and RAM for data storage, enabling the development of complex applications. 5. Robust Connectivity: The chips support various communication interfaces like USB, Ethernet, and CAN, allowing seamless connectivity with other devices or networks.Application Scenarios: 1. Industrial Automation: The high performance and robust connectivity features make these chips suitable for industrial automation applications, such as PLCs (Programmable Logic Controllers), motor control systems, and industrial communication devices. 2. Internet of Things (IoT): The low power consumption and integrated peripherals make these chips ideal for IoT applications, including smart home devices, wearable devices, and sensor nodes. 3. Consumer Electronics: The chips can be used in various consumer electronics applications, such as digital cameras, printers, gaming consoles, and audio/video equipment, where high performance and low power consumption are essential. 4. Automotive Electronics: With their robust connectivity options and high-performance capabilities, these chips can be utilized in automotive electronics applications like infotainment systems, engine control units, and advanced driver-assistance systems (ADAS). 5. Medical Devices: The chips' low power consumption and integrated peripherals make them suitable for medical devices like patient monitoring systems, portable medical devices, and diagnostic equipment.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or system in which the chips are being used.