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MCF5483CZP166

MCF5483CZP166

Manufacturer No:

MCF5483CZP166

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 388PBGA

Datasheet:

Datasheet

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MCF5483CZP166 Specifications

  • Type
    Parameter
  • Supplier Device Package
    388-PBGA (27x27)
  • Package / Case
    388-BBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    External
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    1.43V ~ 1.58V
  • RAM Size
    32K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    99
  • Peripherals
    DMA, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
  • Speed
    166MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    Coldfire V4E
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MCF548x
The MB90673PF-GT-172-BND-BE1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed processing capabilities, making them suitable for applications that require fast and efficient data processing. 2. Low Power Consumption: The chips are designed to consume minimal power, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Compact Size: The chips are compact in size, allowing for easy integration into small electronic devices or systems with limited space. 4. Versatility: These chips are versatile and can be used in a wide range of applications, making them suitable for various industries and sectors. 5. Reliability: The chips are designed to be reliable and durable, ensuring long-term performance and stability.Application Scenarios: 1. Automotive Electronics: The chips can be used in automotive applications such as engine control units, transmission control units, and body control modules. 2. Industrial Automation: These chips are suitable for industrial automation applications like programmable logic controllers (PLCs), motor control systems, and robotics. 3. Consumer Electronics: The chips can be used in various consumer electronic devices such as smart home systems, wearable devices, and home appliances. 4. Medical Devices: These chips can be utilized in medical devices like patient monitoring systems, diagnostic equipment, and medical imaging devices. 5. Internet of Things (IoT): The chips can be integrated into IoT devices and systems, enabling connectivity and data processing for smart cities, smart grids, and other IoT applications.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the particular chip model.
MCF5483CZP166 Relevant information