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MCF5474ZP200

MCF5474ZP200

Manufacturer No:

MCF5474ZP200

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 388PBGA

Datasheet:

Datasheet

Delivery:

Payment:

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MCF5474ZP200 Specifications

  • Type
    Parameter
  • Supplier Device Package
    388-PBGA (27x27)
  • Package / Case
    388-BBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    External
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    1.43V ~ 1.58V
  • RAM Size
    32K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    99
  • Peripherals
    DMA, PWM, WDT
  • Connectivity
    EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
  • Speed
    200MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    Coldfire V4E
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    MCF547x
The MB90673PF-G-361-BND-BE1 is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High Performance: The MB90673PF-G-361-BND-BE1 is designed to deliver high performance with its advanced architecture and features. It may offer fast processing speeds, efficient power consumption, and reliable operation.2. Integrated Features: This IC chip may include various integrated features such as a microcontroller unit (MCU), memory, communication interfaces, analog-to-digital converters (ADCs), timers, and more. These integrated features can simplify the design process and reduce the need for external components.3. Versatility: The MB90673PF-G-361-BND-BE1 may be suitable for a wide range of applications due to its versatility. It can be programmed to perform different tasks and support various functions, making it adaptable to different use cases.4. Cost-Effective: By integrating multiple functions into a single chip, the MB90673PF-G-361-BND-BE1 can potentially reduce the overall system cost. It eliminates the need for additional components, reduces board space requirements, and simplifies the manufacturing process.Application Scenarios: 1. Automotive Electronics: The MB90673PF-G-361-BND-BE1 may find applications in automotive electronics, such as engine control units (ECUs), transmission control units (TCUs), body control modules (BCMs), and more. Its high performance, integrated features, and reliability make it suitable for automotive applications.2. Industrial Automation: This IC chip can be used in industrial automation systems, including programmable logic controllers (PLCs), motor control units, and sensor interfaces. Its versatility and integrated features enable efficient control and monitoring of industrial processes.3. Consumer Electronics: The MB90673PF-G-361-BND-BE1 may be utilized in various consumer electronics devices, such as home appliances, audio/video equipment, and gaming consoles. Its high performance and integrated features can enhance the functionality and user experience of these devices.4. Internet of Things (IoT): With its low power consumption and integrated communication interfaces, this IC chip can be employed in IoT devices and applications. It can enable connectivity, data processing, and control in IoT systems, such as smart home devices, wearable technology, and environmental monitoring systems.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to consult the datasheet and technical documentation provided by the manufacturer for detailed information on the capabilities and recommended applications of the MB90673PF-G-361-BND-BE1 IC chip.
MCF5474ZP200 Relevant information