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MCF5275CVM133

MCF5275CVM133

Manufacturer No:

MCF5275CVM133

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 256MAPBGA

Datasheet:

Datasheet

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MCF5275CVM133 Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-MAPBGA (17x17)
  • Package / Case
    256-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    External
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    1.4V ~ 1.6V
  • RAM Size
    64K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    69
  • Peripherals
    DMA, WDT
  • Connectivity
    EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
  • Speed
    133MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    Coldfire V2
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MCF527x
The R5F10BGECKFB#35 integrated circuit chips, also known as microcontrollers, have several advantages and application scenarios:Advantages: 1. High-performance: These chips are designed to provide high processing power and performance, making them suitable for complex applications. 2. Low power consumption: They are optimized for low power consumption, making them ideal for battery-powered devices or applications where energy efficiency is crucial. 3. Compact size: The chips are small in size, allowing for easy integration into various devices and systems. 4. Rich peripheral set: They come with a wide range of built-in peripherals such as timers, UART, I2C, SPI, ADC, etc., which simplifies the design process and reduces the need for external components. 5. Enhanced security features: These chips often include security features like encryption and tamper detection, making them suitable for applications that require data protection.Application scenarios: 1. Internet of Things (IoT): The R5F10BGECKFB#35 chips can be used in IoT devices such as smart home systems, wearable devices, and industrial sensors, where low power consumption, compact size, and connectivity are essential. 2. Automotive: These chips are suitable for automotive applications like engine control units (ECUs), body control modules (BCMs), and infotainment systems, where high performance, reliability, and security are crucial. 3. Consumer electronics: They can be used in various consumer electronics devices like smart appliances, remote controls, gaming consoles, and audio systems, where compact size, low power consumption, and rich peripheral features are required. 4. Industrial automation: The chips can be utilized in industrial automation systems, robotics, and control systems, where high performance, reliability, and connectivity are necessary. 5. Medical devices: These chips can be employed in medical devices like patient monitoring systems, insulin pumps, and portable medical equipment, where low power consumption, compact size, and security features are important.It's important to note that the specific advantages and application scenarios may vary depending on the exact specifications and capabilities of the R5F10BGECKFB#35 chips.
MCF5275CVM133 Relevant information