MCF5275LCVM133
Manufacturer No:
MCF5275LCVM133
Manufacturer:
Description:
IC MCU 32BIT ROMLESS 196MAPBGA
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MCF5275LCVM133 Specifications
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TypeParameter
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Supplier Device Package196-LBGA (15x15)
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Package / Case196-LBGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Oscillator TypeExternal
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Data Converters-
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Voltage - Supply (Vcc/Vdd)1.4V ~ 1.6V
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RAM Size64K x 8
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EEPROM Size-
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Program Memory TypeROMless
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Program Memory Size-
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Number of I/O61
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PeripheralsDMA, WDT
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ConnectivityEBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
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Speed133MHz
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Core Size32-Bit Single-Core
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Core ProcessorColdfire V2
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusObsolete
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SeriesMCF527x
The XAZU7EV-1FBVB900Q is a specific model of integrated circuit (IC) chip developed by Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The XAZU7EV-1FBVB900Q chip provides high-performance processing capabilities with its quad-core ARM Cortex-A53 processor and dual-core ARM Cortex-R5 real-time processor. It also includes programmable logic resources, enabling hardware acceleration and customization.2. Versatility: This chip combines the capabilities of both a traditional microprocessor and a programmable logic device, making it suitable for a wide range of applications. It allows for the integration of software and hardware components, providing flexibility and adaptability.3. Power Efficiency: The XAZU7EV-1FBVB900Q chip is designed to be power-efficient, optimizing energy consumption while maintaining high performance. This makes it suitable for applications where power efficiency is crucial, such as portable devices or embedded systems.4. Integrated Peripherals: The chip includes various integrated peripherals, such as USB, Ethernet, PCIe, and memory controllers. These peripherals enhance connectivity and enable seamless integration with other devices or systems.Application Scenarios: 1. Embedded Systems: The XAZU7EV-1FBVB900Q chip is commonly used in embedded systems, where it can serve as a central processing unit (CPU) while also providing programmable logic for custom hardware acceleration. It finds applications in sectors like industrial automation, robotics, automotive, and aerospace.2. Edge Computing: With its high-performance processing capabilities and power efficiency, this chip is suitable for edge computing applications. It can handle real-time data processing and analysis at the edge of a network, reducing latency and enabling faster decision-making.3. Software-Defined Radio (SDR): The XAZU7EV-1FBVB900Q chip's programmable logic resources make it well-suited for SDR applications. It can be used to implement signal processing algorithms and adapt to different wireless communication standards.4. High-Performance Computing: The chip's powerful processing capabilities and programmable logic resources make it suitable for high-performance computing applications. It can be used in areas like scientific research, data centers, and cloud computing.5. Internet of Things (IoT): The XAZU7EV-1FBVB900Q chip's versatility and power efficiency make it suitable for IoT applications. It can handle data processing, connectivity, and control tasks in IoT devices, enabling smart and connected systems.These are just a few examples of the advantages and application scenarios of the XAZU7EV-1FBVB900Q integrated circuit chip. Its flexibility, performance, and power efficiency make it a versatile solution for various embedded and high-performance computing applications.
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