Home / Microcontrollers / MC9S12NE64VTU/
MC9S12NE64VTU

MC9S12NE64VTU

Manufacturer No:

MC9S12NE64VTU

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 64KB FLASH 80TQFP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MC9S12NE64VTU Specifications

  • Type
    Parameter
  • Supplier Device Package
    80-TQFP-EP (14x14)
  • Package / Case
    80-TQFP Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    2.375V ~ 3.465V
  • RAM Size
    8K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    64KB (64K x 8)
  • Number of I/O
    38
  • Peripherals
    POR, PWM, WDT
  • Connectivity
    EBI/EMI, Ethernet, I²C, SCI, SPI
  • Speed
    25MHz
  • Core Size
    16-Bit
  • Core Processor
    HCS12
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    HCS12
The S6E2001G0AGB1B01B integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 2. High performance: The chips offer high processing power and performance, enabling them to handle complex tasks and applications efficiently. 3. Integrated peripherals: They come with various integrated peripherals such as timers, UART, I2C, SPI, and GPIO, which simplify the design process and reduce the need for external components. 4. Rich display capabilities: The chips support various display interfaces, including TFT LCD, OLED, and E-ink displays, allowing for versatile display applications. 5. Flexible memory options: They offer different memory configurations, including Flash memory and SRAM, providing flexibility for storing and accessing data.Application scenarios: 1. Wearable devices: The low power consumption and integrated peripherals make these chips suitable for wearable devices like smartwatches, fitness trackers, and health monitoring devices. 2. Internet of Things (IoT): The chips can be used in IoT devices such as smart home appliances, environmental sensors, and industrial monitoring systems, thanks to their low power consumption and integrated connectivity options. 3. Consumer electronics: They can be utilized in various consumer electronics devices like smartphones, tablets, e-readers, and portable gaming consoles, benefiting from their high performance and display capabilities. 4. Industrial automation: The chips can be employed in industrial automation systems, including control panels, human-machine interfaces (HMIs), and programmable logic controllers (PLCs), due to their high performance and integrated peripherals. 5. Automotive applications: These chips can be used in automotive applications like infotainment systems, instrument clusters, and advanced driver-assistance systems (ADAS), leveraging their display capabilities, memory options, and connectivity features.It's important to note that the specific advantages and application scenarios may vary depending on the exact requirements and specifications of the S6E2001G0AGB1B01B integrated circuit chips.
MC9S12NE64VTU Relevant information