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MC9S12DG256BMPV

MC9S12DG256BMPV

Manufacturer No:

MC9S12DG256BMPV

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 256KB FLASH 112LQFP

Datasheet:

Datasheet

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MC9S12DG256BMPV Specifications

  • Type
    Parameter
  • Supplier Device Package
    112-LQFP (20x20)
  • Package / Case
    112-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 16x10b
  • Voltage - Supply (Vcc/Vdd)
    2.35V ~ 5.25V
  • RAM Size
    12K x 8
  • EEPROM Size
    4K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    256KB (256K x 8)
  • Number of I/O
    91
  • Peripherals
    PWM, WDT
  • Connectivity
    CANbus, I²C, SCI, SPI
  • Speed
    25MHz
  • Core Size
    16-Bit
  • Core Processor
    HCS12
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    HCS12
The UPD703235GC(A)-L02-8EA-A integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a clock frequency of up to 50 MHz, making them suitable for demanding applications. 2. Low Power Consumption: The chips are designed to operate at low power, making them energy-efficient and suitable for battery-powered devices. 3. Small Form Factor: The chips are available in a compact form factor, making them suitable for applications with space constraints. 4. Versatile Interface: The chips support various interfaces such as UART, I2C, and SPI, making them compatible with a wide range of devices. 5. Robust Communication: The chips have built-in error detection and correction mechanisms, ensuring reliable communication in noisy environments.Application Scenarios: 1. Industrial Automation: These chips can be used in industrial automation systems for communication between different devices and sensors. 2. Internet of Things (IoT): The chips can be used in IoT devices for wireless communication and data transfer. 3. Consumer Electronics: These chips can be used in various consumer electronics devices such as smartwatches, fitness trackers, and home automation systems. 4. Automotive Electronics: The chips can be used in automotive electronics for communication between different components and systems. 5. Medical Devices: These chips can be used in medical devices for data transfer and communication between different medical equipment.Overall, the UPD703235GC(A)-L02-8EA-A integrated circuit chips offer high performance, low power consumption, and versatile interface options, making them suitable for a wide range of applications in different industries.
MC9S12DG256BMPV Relevant information