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MC9S12DG256BCFU

MC9S12DG256BCFU

Manufacturer No:

MC9S12DG256BCFU

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 256KB FLASH 80QFP

Datasheet:

Datasheet

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MC9S12DG256BCFU Specifications

  • Type
    Parameter
  • Supplier Device Package
    80-QFP (14x14)
  • Package / Case
    80-QFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 16x10b
  • Voltage - Supply (Vcc/Vdd)
    2.35V ~ 5.25V
  • RAM Size
    12K x 8
  • EEPROM Size
    4K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    256KB (256K x 8)
  • Number of I/O
    59
  • Peripherals
    PWM, WDT
  • Connectivity
    CANbus, I²C, SCI, SPI
  • Speed
    25MHz
  • Core Size
    16-Bit
  • Core Processor
    HCS12
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    HCS12
The MB90497GPFM-G-171-BNDE1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The chips are based on the 32-bit RISC CPU core, which provides high processing power and performance. 2. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered devices and energy-efficient applications. 3. Integrated Peripherals: The chips come with various integrated peripherals such as UART, I2C, SPI, timers, and ADC, reducing the need for external components and simplifying the overall system design. 4. Enhanced Security: The chips offer advanced security features like memory protection units, secure boot, and encryption, ensuring the safety of sensitive data and preventing unauthorized access. 5. Wide Operating Temperature Range: The chips can operate reliably in a wide temperature range, making them suitable for industrial and automotive applications.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for controlling and monitoring various processes, such as robotics, machine control, and data acquisition. 2. Automotive Electronics: The chips are suitable for automotive applications like engine control units (ECUs), body control modules (BCMs), and infotainment systems, providing high performance and reliability. 3. Consumer Electronics: The chips can be used in various consumer electronic devices like smart home appliances, wearable devices, and gaming consoles, offering low power consumption and advanced features. 4. Medical Devices: The chips can be utilized in medical devices such as patient monitoring systems, diagnostic equipment, and portable medical devices, ensuring high performance and data security. 5. Internet of Things (IoT): The chips can be integrated into IoT devices and edge computing systems, enabling connectivity, data processing, and control in smart homes, smart cities, and industrial IoT applications.Overall, the MB90497GPFM-G-171-BNDE1 integrated circuit chips offer high performance, low power consumption, and advanced features, making them suitable for a wide range of applications in various industries.
MC9S12DG256BCFU Relevant information