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MC9S12DG128CPV

MC9S12DG128CPV

Manufacturer No:

MC9S12DG128CPV

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 128KB FLASH 112LQFP

Datasheet:

Datasheet

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MC9S12DG128CPV Specifications

  • Type
    Parameter
  • Supplier Device Package
    112-LQFP (20x20)
  • Package / Case
    112-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 16x10b
  • Voltage - Supply (Vcc/Vdd)
    2.35V ~ 5.25V
  • RAM Size
    8K x 8
  • EEPROM Size
    2K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    128KB (128K x 8)
  • Number of I/O
    91
  • Peripherals
    PWM, WDT
  • Connectivity
    CANbus, I²C, SCI, SPI
  • Speed
    25MHz
  • Core Size
    16-Bit
  • Core Processor
    HCS12
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    HCS12
The MB89951APMC-G-111-BNDE1 is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89951APMC-G-111-BNDE1 chip is designed to deliver high performance, making it suitable for demanding applications that require fast processing speeds and efficient data handling.2. Low Power Consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial.3. Integrated Features: The chip integrates various features and peripherals, reducing the need for additional external components and simplifying the overall system design.4. Robust Security: The MB89951APMC-G-111-BNDE1 chip may include built-in security features such as encryption and authentication, making it suitable for applications that require secure data processing and communication.Application Scenarios: 1. Industrial Automation: The high performance and integrated features of this chip make it suitable for industrial automation applications such as robotics, control systems, and data acquisition.2. Internet of Things (IoT): The low power consumption and integrated features make this chip suitable for IoT devices that require efficient data processing and connectivity.3. Automotive Electronics: The chip's high performance and robust security features make it suitable for automotive applications such as engine control units, advanced driver-assistance systems (ADAS), and infotainment systems.4. Consumer Electronics: The chip's high performance and low power consumption make it suitable for various consumer electronics applications such as smart home devices, wearable devices, and multimedia systems.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the particular model of the chip. It is recommended to refer to the manufacturer's documentation and datasheets for detailed information on the capabilities and recommended applications of the MB89951APMC-G-111-BNDE1 chip.
MC9S12DG128CPV Relevant information