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MC912DG128ACPV

MC912DG128ACPV

Manufacturer No:

MC912DG128ACPV

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 128KB FLASH 112LQFP

Datasheet:

Datasheet

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MC912DG128ACPV Specifications

  • Type
    Parameter
  • Supplier Device Package
    112-LQFP (20x20)
  • Package / Case
    112-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 16x8/10b
  • Voltage - Supply (Vcc/Vdd)
    4.5V ~ 5.5V
  • RAM Size
    8K x 8
  • EEPROM Size
    2K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    128KB (128K x 8)
  • Number of I/O
    69
  • Peripherals
    POR, PWM, WDT
  • Connectivity
    CANbus, I²C, SCI, SPI
  • Speed
    8MHz
  • Core Size
    16-Bit
  • Core Processor
    CPU12
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    HC12
The MB90678PF-G-238-BND-BE1 is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High Performance: The MB90678PF-G-238-BND-BE1 chip is designed to deliver high performance with its advanced architecture and optimized circuitry. 2. Low Power Consumption: It is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 3. Compact Size: The chip is compact in size, allowing for space-saving designs and integration into small form factor devices. 4. Integrated Peripherals: It comes with various integrated peripherals such as timers, UART, I2C, SPI, ADC, etc., which can simplify the overall system design and reduce the need for external components. 5. Robust Connectivity: The chip supports various communication interfaces like CAN, LIN, and Ethernet, enabling seamless connectivity with other devices or systems.Application Scenarios: 1. Automotive Electronics: The MB90678PF-G-238-BND-BE1 chip is suitable for automotive applications such as engine control units (ECUs), body control modules (BCMs), powertrain control modules (PCMs), etc., where high performance, low power consumption, and robust connectivity are required. 2. Industrial Automation: It can be used in industrial automation systems for controlling and monitoring various processes, machinery, or equipment. The integrated peripherals and communication interfaces make it suitable for applications like motor control, sensor interfacing, data acquisition, etc. 3. Consumer Electronics: The chip can be utilized in consumer electronic devices like smart appliances, home automation systems, IoT devices, etc., where compact size, low power consumption, and connectivity options are essential. 4. Medical Devices: It can find applications in medical devices such as patient monitoring systems, diagnostic equipment, or portable medical devices, where high performance, low power consumption, and connectivity are crucial. 5. Internet of Things (IoT): The chip's compact size, low power consumption, and integrated peripherals make it suitable for IoT applications, including smart sensors, wearable devices, or edge computing devices.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or product. It is recommended to refer to the datasheet and consult with the manufacturer for detailed information and suitability for specific applications.
MC912DG128ACPV Relevant information