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MC68HC705P6AMDW

MC68HC705P6AMDW

Manufacturer No:

MC68HC705P6AMDW

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 4.5KB OTP 28SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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MC68HC705P6AMDW Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SOIC
  • Package / Case
    28-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 4x8b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    176 x 8
  • EEPROM Size
    -
  • Program Memory Type
    OTP
  • Program Memory Size
    4.5KB (4.5K x 8)
  • Number of I/O
    21
  • Peripherals
    POR, WDT
  • Connectivity
    SIO
  • Speed
    2.1MHz
  • Core Size
    8-Bit
  • Core Processor
    HC05
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    HC05
The MB89925PF-G-202-BNDE1 is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements and context, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89925PF-G-202-BNDE1 chip is designed to deliver high performance, making it suitable for demanding applications. 2. Low Power Consumption: It is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Compact Size: The chip is compact in size, allowing for space-saving designs and integration into small form factor devices. 4. Integrated Features: It may include various integrated features such as analog-to-digital converters (ADC), digital-to-analog converters (DAC), timers, communication interfaces, and more, reducing the need for external components and simplifying the overall design. 5. Robustness and Reliability: Fujitsu is known for producing reliable and robust chips, ensuring stable operation even in challenging environments.Application Scenarios: 1. Industrial Automation: The MB89925PF-G-202-BNDE1 chip can be used in industrial automation systems for controlling and monitoring various processes, such as motor control, sensor interfacing, and data acquisition. 2. Internet of Things (IoT): With its low power consumption and integrated features, this chip can be used in IoT devices for collecting and processing sensor data, wireless communication, and control applications. 3. Consumer Electronics: It can be used in various consumer electronic devices, such as smart home devices, wearable devices, and portable devices, where high performance and low power consumption are essential. 4. Automotive Electronics: The chip's robustness and reliability make it suitable for automotive applications, including engine control units, dashboard systems, and safety systems. 5. Medical Devices: The chip can be used in medical devices for data acquisition, signal processing, and control applications, where reliability and performance are critical.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to refer to the datasheet and consult with the manufacturer for detailed information and suitability for a specific application.
MC68HC705P6AMDW Relevant information