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MCF5272VF66

MCF5272VF66

Manufacturer No:

MCF5272VF66

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT 16KB ROM 196MAPBGA

Datasheet:

Datasheet

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Payment:

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MCF5272VF66 Specifications

  • Type
    Parameter
  • Supplier Device Package
    196-LBGA (15x15)
  • Package / Case
    196-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    External
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 3.6V
  • RAM Size
    1K x 32
  • EEPROM Size
    -
  • Program Memory Type
    ROM
  • Program Memory Size
    16KB (4K x 32)
  • Number of I/O
    32
  • Peripherals
    DMA, WDT
  • Connectivity
    EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
  • Speed
    66MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    Coldfire V2
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MCF527x
The MB90673PF-G-269-BND-BE1 is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High Performance: The MB90673PF-G-269-BND-BE1 chip is designed to deliver high performance and efficiency, making it suitable for demanding applications. 2. Low Power Consumption: This chip is optimized for low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Compact Size: The IC chip is compact in size, allowing for space-saving designs and integration into small form factor devices. 4. Integrated Features: The chip may include various integrated features such as analog-to-digital converters (ADCs), timers, communication interfaces, and other peripherals, reducing the need for external components and simplifying the overall system design. 5. Robustness and Reliability: Fujitsu IC chips are known for their robustness and reliability, ensuring stable operation even in challenging environments.Application Scenarios: 1. Industrial Automation: The MB90673PF-G-269-BND-BE1 chip can be used in industrial automation systems for controlling and monitoring various processes, such as motor control, sensor interfacing, and data acquisition. 2. Automotive Electronics: This IC chip can find applications in automotive electronics, including engine control units (ECUs), powertrain control modules (PCMs), and other systems requiring high-performance microcontrollers. 3. Consumer Electronics: The chip can be used in various consumer electronic devices, such as home appliances, audio/video equipment, gaming consoles, and smart devices, where low power consumption and compact size are essential. 4. Internet of Things (IoT): With its low power consumption and integrated features, the chip can be utilized in IoT devices, including smart sensors, wearable devices, and connected devices for home automation. 5. Medical Devices: The MB90673PF-G-269-BND-BE1 chip can be employed in medical devices, such as patient monitoring systems, diagnostic equipment, and portable medical devices, where reliability and performance are critical.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to consult the datasheet and technical documentation provided by Fujitsu for detailed information on the capabilities and recommended applications of the MB90673PF-G-269-BND-BE1 chip.
MCF5272VF66 Relevant information