MPC561MZP66

MPC561MZP66

Manufacturer No:

MPC561MZP66

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 388PBGA

Datasheet:

Datasheet

Delivery:

Payment:

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MPC561MZP66 Specifications

  • Type
    Parameter
  • Supplier Device Package
    388-PBGA (27x27)
  • Package / Case
    388-BBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 32x10b
  • Voltage - Supply (Vcc/Vdd)
    2.5V ~ 2.7V
  • RAM Size
    32K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    64
  • Peripherals
    POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, SCI, SPI, UART/USART
  • Speed
    66MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    PowerPC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MPC5xx
The MB89925PF-G-147-BNDE1 is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89925PF-G-147-BNDE1 chip is designed to deliver high performance, making it suitable for demanding applications. 2. Low Power Consumption: It is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Integrated Features: The chip integrates various features and peripherals, reducing the need for external components and simplifying the overall design. 4. Small Form Factor: The chip is available in a compact package, making it suitable for space-constrained applications.Application Scenarios: 1. Industrial Automation: The MB89925PF-G-147-BNDE1 chip can be used in industrial automation systems for controlling and monitoring various processes. 2. Consumer Electronics: It can be used in consumer electronics devices such as smart home appliances, wearable devices, or IoT devices. 3. Automotive: The chip can be utilized in automotive applications for controlling various functions like engine management, infotainment systems, or driver assistance systems. 4. Medical Devices: It can be used in medical devices for data acquisition, signal processing, or control functions. 5. Communication Systems: The chip can be used in communication systems for data processing, encryption, or network management.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to refer to the datasheet and technical documentation provided by the manufacturer for detailed information about the chip's capabilities and recommended applications.