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MMC2113CFCPV33

MMC2113CFCPV33

Manufacturer No:

MMC2113CFCPV33

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT 128KB FLASH 144LQFP

Datasheet:

Datasheet

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MMC2113CFCPV33 Specifications

  • Type
    Parameter
  • Supplier Device Package
    144-LQFP (20x20)
  • Package / Case
    144-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 3.6V
  • RAM Size
    8K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    128KB (128K x 8)
  • Number of I/O
    104
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    EBI/EMI, SCI, SPI
  • Speed
    33MHz
  • Core Size
    16/32-Bit
  • Core Processor
    M210
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MCore
The UPD70F3557AM1GMA1-GBK-AX integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The chips are designed to deliver high performance with a 32-bit RISC CPU core, capable of executing instructions at high speeds. 2. Low Power Consumption: The chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Rich Peripherals: The chips come with a wide range of built-in peripherals such as timers, UART, I2C, SPI, ADC, and PWM, providing flexibility and reducing the need for external components. 4. Ample Memory: The chips have a large on-chip memory, including flash memory for program storage and RAM for data storage, enabling the execution of complex applications. 5. Enhanced Security: The chips offer security features like memory protection units and code flash security, ensuring the integrity and confidentiality of the stored data.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for controlling and monitoring various processes, thanks to their high performance, low power consumption, and rich peripheral set. 2. Automotive Electronics: The chips find applications in automotive electronics, such as engine control units (ECUs), body control modules (BCMs), and instrument clusters, due to their robustness, low power consumption, and security features. 3. Consumer Electronics: The chips can be utilized in consumer electronics devices like home appliances, gaming consoles, and audio/video equipment, benefiting from their high performance, low power consumption, and ample memory. 4. Internet of Things (IoT): The chips are suitable for IoT applications, where low power consumption, security, and connectivity are essential. They can be used in smart home devices, wearable devices, and sensor nodes. 5. Medical Devices: The chips can be employed in medical devices like patient monitoring systems, infusion pumps, and diagnostic equipment, leveraging their high performance, low power consumption, and security features.Overall, the UPD70F3557AM1GMA1-GBK-AX integrated circuit chips offer a combination of performance, power efficiency, security, and rich peripherals, making them suitable for a wide range of applications in various industries.
MMC2113CFCPV33 Relevant information