MCF5282CVF66

MCF5282CVF66

Manufacturer No:

MCF5282CVF66

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32B 512KB FLASH 256MAPBGA

Datasheet:

Datasheet

Delivery:

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MCF5282CVF66 Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-MAPBGA (17x17)
  • Package / Case
    256-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 3.6V
  • RAM Size
    64K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    512KB (512K x 8)
  • Number of I/O
    142
  • Peripherals
    DMA, LVD, POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
  • Speed
    66MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    Coldfire V2
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    MCF528x
The MB89663RPF-G-190-BNDE1 is a specific model of integrated circuit chip manufactured by Fujitsu. It belongs to the MB89660R/660R series of 16-bit microcontrollers. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance: The MB89663RPF-G-190-BNDE1 chip offers a high processing speed and performance, making it suitable for demanding applications. 2. Low power consumption: It is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 3. Rich peripheral set: The chip comes with a wide range of built-in peripherals, including timers, serial interfaces, analog-to-digital converters, and more, providing flexibility and reducing the need for external components. 4. Ample memory: It has a large on-chip memory, including flash memory for program storage and RAM for data storage, allowing for complex applications and data manipulation. 5. Enhanced security features: The chip incorporates security features like memory protection and encryption, making it suitable for applications that require data security.Application scenarios: 1. Industrial automation: The high-performance and rich peripheral set of the MB89663RPF-G-190-BNDE1 chip make it suitable for various industrial automation applications, such as motor control, robotics, and process control systems. 2. Consumer electronics: The low power consumption and ample memory of the chip make it suitable for consumer electronics devices like smart home appliances, wearable devices, and portable gadgets. 3. Automotive systems: The chip's robustness, high performance, and security features make it suitable for automotive applications, including engine control units, dashboard systems, and safety systems. 4. Medical devices: The chip's low power consumption, security features, and processing capabilities make it suitable for medical devices like patient monitoring systems, medical imaging equipment, and diagnostic devices. 5. Internet of Things (IoT): The chip's low power consumption, ample memory, and built-in communication interfaces make it suitable for IoT applications, such as smart sensors, connected devices, and remote monitoring systems.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of the project.