MC68HC908GR16CFA

MC68HC908GR16CFA

Manufacturer No:

MC68HC908GR16CFA

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 16KB FLASH 48LQFP

Datasheet:

Datasheet

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MC68HC908GR16CFA Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-LQFP (7x7)
  • Package / Case
    48-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    1K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    16KB (16K x 8)
  • Number of I/O
    37
  • Peripherals
    LVD, POR, PWM
  • Connectivity
    LINbus, SCI, SPI
  • Speed
    8MHz
  • Core Size
    8-Bit
  • Core Processor
    HC08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    HC08
The CP3BT26G18NEPX integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed data processing capabilities, making them suitable for applications that require fast and efficient data processing. 2. Low Power Consumption: The chips are designed to consume minimal power, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Compact Size: The chips are compact in size, allowing for easy integration into various electronic devices and systems. 4. Versatility: These chips can be used in a wide range of applications, thanks to their flexible design and compatibility with different systems. 5. Reliability: The chips are built with high-quality materials and undergo rigorous testing, ensuring their reliability and durability.Application Scenarios: 1. Internet of Things (IoT): The CP3BT26G18NEPX chips can be used in IoT devices, such as smart home systems, wearables, and industrial sensors, to enable wireless connectivity and data processing. 2. Wireless Communication: These chips can be utilized in wireless communication systems, including Bluetooth-enabled devices, wireless audio systems, and wireless data transfer applications. 3. Consumer Electronics: The chips can be integrated into various consumer electronic devices like smartphones, tablets, gaming consoles, and smart TVs to enhance their wireless connectivity and data processing capabilities. 4. Industrial Automation: The chips can be employed in industrial automation systems, such as robotics, process control, and monitoring systems, to enable wireless communication and data processing. 5. Automotive: These chips can be used in automotive applications, including infotainment systems, telematics, and wireless connectivity for vehicle-to-vehicle communication. 6. Healthcare: The chips can be utilized in medical devices and healthcare systems for wireless data transmission, remote monitoring, and patient tracking applications.Overall, the CP3BT26G18NEPX integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in various industries.