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UPD70F3523GJA-GAE-H

UPD70F3523GJA-GAE-H

Manufacturer No:

UPD70F3523GJA-GAE-H

Description:

IC MCU 32BIT 512KB FLASH 144LQFP

Datasheet:

Datasheet

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UPD70F3523GJA-GAE-H Specifications

  • Type
    Parameter
  • Supplier Device Package
    144-LQFP (20x20)
  • Package / Case
    144-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 16x12b
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 5.5V
  • RAM Size
    48K x 8
  • EEPROM Size
    32K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    512KB (512K x 8)
  • Number of I/O
    195
  • Peripherals
    DMA, I²S, LCD, LVD, POR, PWM, WDT
  • Connectivity
    CANbus, CSI, I²C, LINbus, UART/USART
  • Speed
    40MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    V850E2M
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    V850E2/Dx4
The HI3-0303-5Z integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The HI3-0303-5Z chips are designed to deliver high performance with low power consumption, making them suitable for various applications. 2. Small Size: These chips are compact in size, which makes them ideal for space-constrained applications. 3. Versatility: The HI3-0303-5Z chips can be used in a wide range of applications due to their versatile nature. 4. Low Power Consumption: These chips are designed to consume low power, making them energy-efficient and suitable for battery-powered devices. 5. High Reliability: The HI3-0303-5Z chips are known for their high reliability, ensuring stable and consistent performance.Application Scenarios: 1. Consumer Electronics: These chips can be used in various consumer electronic devices such as smartphones, tablets, wearables, and gaming consoles. 2. Internet of Things (IoT): The HI3-0303-5Z chips can be utilized in IoT devices like smart home appliances, security systems, and industrial automation. 3. Automotive: These chips can be integrated into automotive systems for applications like advanced driver-assistance systems (ADAS), infotainment systems, and vehicle connectivity. 4. Industrial Automation: The HI3-0303-5Z chips can be used in industrial automation applications such as robotics, control systems, and monitoring devices. 5. Medical Devices: These chips can be employed in medical devices like patient monitoring systems, diagnostic equipment, and implantable devices.Overall, the HI3-0303-5Z integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in various industries.
UPD70F3523GJA-GAE-H Relevant information