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R7F7010113AFP-C#AA8

R7F7010113AFP-C#AA8

Manufacturer No:

R7F7010113AFP-C#AA8

Description:

IC MCU 32BIT 256KB FLASH 64LFQFP

Datasheet:

Datasheet

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R7F7010113AFP-C#AA8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-LFQFP (10x10)
  • Package / Case
    64-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 11x12b, 10x10b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    32K x 8
  • EEPROM Size
    32K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    256KB (256K x 8)
  • Number of I/O
    49
  • Peripherals
    DMA, LVD, POR, PWM, WDT
  • Connectivity
    CANbus, CSI, I²C, LINbus, SPI, UART/USART
  • Speed
    80MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    RH850G3K
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    RH850/F1L
The TLE9861QXA20XUMA1 is an integrated circuit chip developed by Infineon Technologies. It is a System-on-Chip (SoC) solution designed for automotive applications. Here are some advantages and application scenarios of the TLE9861QXA20XUMA1:Advantages: 1. Integration: The TLE9861QXA20XUMA1 integrates various functions required for automotive applications, including a microcontroller, power management, LIN transceiver, and high-side and low-side drivers. This integration reduces the need for external components, simplifies the design, and saves board space.2. High Performance: The chip features a powerful ARM Cortex-M0 microcontroller core, which provides high processing power and enables efficient execution of complex algorithms. It also offers a wide range of communication interfaces, such as LIN, SPI, and I2C, for seamless integration with other automotive systems.3. Robustness: The TLE9861QXA20XUMA1 is designed to meet the stringent requirements of the automotive industry. It operates over a wide temperature range and is resistant to electromagnetic interference (EMI) and electrostatic discharge (ESD). This ensures reliable operation in harsh automotive environments.Application Scenarios: 1. Body Control Modules: The TLE9861QXA20XUMA1 can be used in body control modules (BCMs) to control various functions like lighting, door locks, window controls, and seat controls. Its integrated high-side and low-side drivers simplify the design of these modules and enable efficient control of different loads.2. HVAC Systems: The chip can be employed in heating, ventilation, and air conditioning (HVAC) systems to control fan speed, temperature regulation, and air distribution. Its powerful microcontroller and communication interfaces facilitate the implementation of advanced control algorithms for optimal HVAC performance.3. Motor Control: The TLE9861QXA20XUMA1 is suitable for motor control applications, such as window lifters, sunroofs, and seat motors. Its integrated drivers and high processing power enable precise and efficient control of motors, ensuring smooth operation and improved energy efficiency.4. Lighting Systems: The chip can be utilized in automotive lighting systems, including headlights, taillights, and interior lighting. Its integrated drivers and communication interfaces allow for flexible control of different lighting functions, such as dimming, sequencing, and dynamic lighting effects.Overall, the TLE9861QXA20XUMA1 offers a highly integrated and robust solution for various automotive applications, providing advantages in terms of performance, reliability, and design simplicity.
R7F7010113AFP-C#AA8 Relevant information