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R7F7010123AFP-C#AA8

R7F7010123AFP-C#AA8

Manufacturer No:

R7F7010123AFP-C#AA8

Description:

IC MCU 32BIT 384KB FLASH 64LFQFP

Datasheet:

Datasheet

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R7F7010123AFP-C#AA8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-LFQFP (10x10)
  • Package / Case
    64-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 11x12b, 10x10b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    48K x 8
  • EEPROM Size
    32K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    384KB (384K x 8)
  • Number of I/O
    49
  • Peripherals
    DMA, LVD, POR, PWM, WDT
  • Connectivity
    CANbus, CSI, I²C, LINbus, SPI, UART/USART
  • Speed
    80MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    RH850G3K
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    RH850/F1L
The CP3SP33SMRX/NOPB integrated circuit chips, also known as the CP3SP33, are high-speed, low-power, and low-jitter clock buffers and fanout buffers. They offer several advantages and can be applied in various scenarios, including:1. High-speed clock distribution: The CP3SP33 chip provides low-skew and low-jitter clock distribution, making it suitable for high-speed applications such as data centers, telecommunications, and networking equipment.2. Low-power consumption: These chips are designed to operate with low power consumption, making them ideal for battery-powered devices, portable electronics, and energy-efficient systems.3. Fanout buffering: The CP3SP33 can buffer and distribute clock signals to multiple devices, ensuring signal integrity and synchronization across the system. This feature is useful in applications where multiple components need to be synchronized, such as in data acquisition systems, test and measurement equipment, and industrial automation.4. Signal conditioning: The CP3SP33 chip can also be used for signal conditioning, providing impedance matching and voltage level translation capabilities. This makes it suitable for applications where signal integrity and compatibility between different voltage domains are critical, such as in mixed-signal systems and communication interfaces.5. Clock redundancy and failover: The CP3SP33 supports clock redundancy and failover mechanisms, allowing seamless switching between primary and backup clock sources. This feature is beneficial in mission-critical systems, aerospace applications, and any scenario where continuous operation is essential.6. High reliability and robustness: These chips are designed to meet stringent quality and reliability standards, making them suitable for applications that require long-term operation, harsh environments, and extended temperature ranges.Overall, the CP3SP33SMRX/NOPB integrated circuit chips offer advantages such as high-speed clock distribution, low power consumption, fanout buffering, signal conditioning, clock redundancy, and high reliability. They find applications in various industries, including telecommunications, networking, data centers, industrial automation, aerospace, and portable electronics.
R7F7010123AFP-C#AA8 Relevant information