Home / Microcontrollers / R5F61663RD50BGV/
R5F61663RD50BGV

R5F61663RD50BGV

Manufacturer No:

R5F61663RD50BGV

Description:

IC MCU 32BIT 384KB ROM 176LFBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

R5F61663RD50BGV Specifications

  • Type
    Parameter
  • Supplier Device Package
    176-LFBGA (13x13)
  • Package / Case
    176-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    External, Internal
  • Data Converters
    A/D 8x10b SAR; D/A 2x8b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 3.6V
  • RAM Size
    40K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROM
  • Program Memory Size
    384KB (384K x 8)
  • Number of I/O
    92
  • Peripherals
    DMA, LVD, POR, PWM, WDT
  • Connectivity
    EBI/EMI, I²C, IrDA, SCI, UART/USART, USB
  • Speed
    50MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    H8SX
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    H8SX/1668R
QGE7320MC integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and applications of these chips are as follows:Advantages: 1. High-Performance Computing: QGE7320MC chips are designed for high-performance computing systems, offering high processing power and efficient data handling capabilities. 2. Multicore Architecture: These chips feature a multicore architecture, allowing for parallel processing and improved performance in multitasking scenarios. 3. Power Efficiency: QGE7320MC chips are optimized for power efficiency, which helps reduce energy consumption and heat dissipation, making them suitable for low-power applications. 4. Scalability: These chips are scalable, meaning they can be configured with multiple chips for increased processing power and performance as per the requirements of different applications. 5. High-Speed Interconnect: The chips are equipped with high-speed interconnectivity capabilities, enabling fast and seamless data transfer between multiple cores and other components.Application Scenarios: 1. Supercomputers: QGE7320MC chips are commonly used in supercomputers, where massive amounts of data need to be processed and analyzed in parallel. These chips offer the necessary computing power and efficiency to handle complex computations. 2. Artificial Intelligence: With their multicore architecture and high-performance capabilities, these chips are well-suited for AI applications such as deep learning, neural networks, and machine learning algorithms, enabling faster training and inference. 3. Data Centers: QGE7320MC chips find application in data centers that require high processing power to handle large-scale data processing, storage, and analysis tasks efficiently. 4. Network Switches and Routers: These chips can be used in network switches and routers to handle the packet forwarding and routing tasks at high speeds, ensuring efficient data transmission and network management. 5. Image and Video Processing: QGE7320MC chips can be utilized in image and video processing applications, such as video surveillance, image recognition, and video transcoding, where real-time processing is crucial.Overall, QGE7320MC integrated circuit chips provide high-performance computing capabilities, power efficiency, and scalability, making them suitable for various demanding applications requiring fast and efficient data processing.
R5F61663RD50BGV Relevant information