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R5F52107BDFB#V0

R5F52107BDFB#V0

Manufacturer No:

R5F52107BDFB#V0

Description:

IC MCU 32BIT 384KB FLSH 144LFQFP

Datasheet:

Datasheet

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R5F52107BDFB#V0 Specifications

  • Type
    Parameter
  • Supplier Device Package
    144-LFQFP (20x20)
  • Package / Case
    144-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 12x12b; D/A 2x10b
  • Voltage - Supply (Vcc/Vdd)
    1.62V ~ 5.5V
  • RAM Size
    64K x 8
  • EEPROM Size
    8K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    384KB (384K x 8)
  • Number of I/O
    122
  • Peripherals
    DMA, LVD, POR, PWM, WDT
  • Connectivity
    I²C, IrDA, SCI, SPI
  • Speed
    50MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    RX
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    RX200
The LA1061M-TLM-E is an integrated circuit chip designed for audio applications. Some of its advantages and application scenarios include:1. High-quality audio processing: The LA1061M-TLM-E chip is designed to provide high-quality audio processing, ensuring clear and crisp sound output.2. Low power consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications.3. Compact size: The LA1061M-TLM-E chip is available in a small form factor, making it suitable for space-constrained applications where size is a critical factor.4. Audio amplification: This chip can be used for audio amplification, allowing it to drive speakers or headphones with sufficient power.5. Audio filtering: The LA1061M-TLM-E chip includes built-in audio filtering capabilities, allowing it to remove unwanted noise or enhance specific frequency ranges.6. Portable audio devices: This chip is commonly used in portable audio devices such as MP3 players, smartphones, tablets, and portable speakers, where high-quality audio processing is required in a compact form factor.7. Automotive audio systems: The LA1061M-TLM-E chip can be used in automotive audio systems to provide high-quality audio processing and amplification for in-car entertainment.8. Home audio systems: This chip can be used in home audio systems, including stereo systems, soundbars, and home theater systems, to enhance audio quality and provide amplification.9. Gaming consoles: The LA1061M-TLM-E chip can be used in gaming consoles to provide audio processing and amplification for an immersive gaming experience.10. Public address systems: This chip can be used in public address systems, such as in airports, stadiums, or conference halls, to provide clear and powerful audio output.Overall, the LA1061M-TLM-E integrated circuit chip offers high-quality audio processing, low power consumption, and compact size, making it suitable for a wide range of audio applications.
R5F52107BDFB#V0 Relevant information