Home / Microcontrollers / R5F21266J078FP#Y3/
R5F21266J078FP#Y3

R5F21266J078FP#Y3

Manufacturer No:

R5F21266J078FP#Y3

Description:

IC MCU 16BIT 32KB FLASH 32LQFP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

R5F21266J078FP#Y3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-LQFP (7x7)
  • Package / Case
    32-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    External, Internal
  • Data Converters
    A/D 12x10b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    1.5K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (32K x 8)
  • Number of I/O
    25
  • Peripherals
    LED, POR, Voltage Detect, WDT
  • Connectivity
    I²C, LINbus, SIO, SSU, UART/USART
  • Speed
    20MHz
  • Core Size
    16-Bit
  • Core Processor
    R8C
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    R8C/2x/26
The MB89663PF-GT-143-BNDE1 is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89663PF-GT-143-BNDE1 chip is designed to deliver high performance with a fast processing speed, making it suitable for applications that require quick data processing and response times. 2. Low Power Consumption: This chip is designed to be power-efficient, which can be advantageous for battery-powered devices or applications where energy efficiency is a priority. 3. Integrated Peripherals: The chip comes with various integrated peripherals such as UART, I2C, SPI, timers, and PWM channels, which can simplify the design and reduce the need for additional external components. 4. Small Form Factor: The chip is available in a compact package, making it suitable for applications with space constraints or where miniaturization is required. 5. Wide Operating Temperature Range: The MB89663PF-GT-143-BNDE1 chip can operate reliably across a wide temperature range, making it suitable for applications in harsh environments.Application Scenarios: 1. Industrial Automation: The high performance and integrated peripherals of this chip make it suitable for industrial automation applications such as motor control, robotics, and process control systems. 2. Internet of Things (IoT): The low power consumption and small form factor of the chip make it suitable for IoT devices such as smart sensors, wearable devices, and home automation systems. 3. Consumer Electronics: The chip can be used in various consumer electronics applications such as gaming consoles, audio/video equipment, and home appliances. 4. Automotive Electronics: The wide operating temperature range and high performance of the chip make it suitable for automotive applications such as engine control units, dashboard systems, and advanced driver-assistance systems (ADAS). 5. Medical Devices: The chip's high performance and integrated peripherals can be utilized in medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to consult the datasheet and technical documentation provided by the manufacturer for detailed information and suitability for specific applications.
R5F21266J078FP#Y3 Relevant information