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R5F21266J077FP#WD

R5F21266J077FP#WD

Manufacturer No:

R5F21266J077FP#WD

Description:

IC MCU 16BIT 32KB FLASH 32LQFP

Datasheet:

Datasheet

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R5F21266J077FP#WD Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-LQFP (7x7)
  • Package / Case
    32-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    External, Internal
  • Data Converters
    A/D 12x10b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    1.5K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (32K x 8)
  • Number of I/O
    25
  • Peripherals
    LED, POR, Voltage Detect, WDT
  • Connectivity
    I²C, LINbus, SIO, SSU, UART/USART
  • Speed
    20MHz
  • Core Size
    16-Bit
  • Core Processor
    R8C
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    R8C/2x/26
The UPD70F3554M1GJA-GBG-QS-AX is a specific model of integrated circuit chip manufactured by Renesas Electronics. While specific advantages and application scenarios may vary depending on the requirements and context, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High-performance microcontroller: The UPD70F3554M1GJA-GBG-QS-AX is a microcontroller chip that offers high-performance processing capabilities, making it suitable for applications that require fast and efficient data processing. 2. Low power consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Rich peripheral set: The chip comes with a rich set of built-in peripherals, such as timers, UART, I2C, SPI, ADC, and more, which can simplify the design and implementation of various applications. 4. Ample memory: The UPD70F3554M1GJA-GBG-QS-AX provides a significant amount of flash memory and RAM, allowing for the storage and execution of complex programs and data. 5. Robust communication capabilities: The chip supports various communication protocols, including CAN, LIN, and Ethernet, enabling seamless integration with other devices or systems.Application Scenarios: 1. Automotive systems: The UPD70F3554M1GJA-GBG-QS-AX is commonly used in automotive applications, such as engine control units (ECUs), body control modules (BCMs), and instrument clusters, due to its high-performance processing, low power consumption, and communication capabilities. 2. Industrial automation: The chip can be utilized in industrial automation systems, such as programmable logic controllers (PLCs), motor control units, and human-machine interfaces (HMIs), where its processing power, memory, and communication features are essential for real-time control and monitoring. 3. Consumer electronics: The UPD70F3554M1GJA-GBG-QS-AX can be employed in various consumer electronic devices, including home appliances, audio/video equipment, and gaming consoles, where its performance, low power consumption, and communication capabilities are advantageous. 4. Internet of Things (IoT): With its communication protocols and low power consumption, the chip can be used in IoT devices, such as smart home systems, wearable devices, and sensor nodes, enabling connectivity and efficient data processing in IoT networks.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and implementation of the chip in a particular system or device.
R5F21266J077FP#WD Relevant information