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CY91F525BSEPMC1-GS-ERE2

CY91F525BSEPMC1-GS-ERE2

Manufacturer No:

CY91F525BSEPMC1-GS-ERE2

Manufacturer:

Infineon Technologies

Description:

IC MCU 32BIT 832KB FLASH 64LQFP

Datasheet:

Datasheet

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CY91F525BSEPMC1-GS-ERE2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-LQFP (10x10)
  • Package / Case
    64-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 26x12b SAR; D/A 1x8b
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 5.5V
  • RAM Size
    104K x 8
  • EEPROM Size
    64K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    832KB (832K x 8)
  • Number of I/O
    44
  • Peripherals
    DMA, LVD, POR, PWM, WDT
  • Connectivity
    CANbus, CSIO, I²C, LINbus, SPI, UART/USART
  • Speed
    80MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    FR81S
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    FR CY91520
The QG6311 integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: The QG6311 chips are designed to operate with low power consumption, making them suitable for battery-powered devices and energy-efficient applications. 2. Small form factor: These chips are compact in size, allowing for integration into small devices and space-constrained applications. 3. High performance: The QG6311 chips offer high performance and processing capabilities, enabling them to handle complex tasks and data processing efficiently. 4. Versatility: These chips support various communication protocols and interfaces, making them versatile for different applications. 5. Cost-effective: The QG6311 chips are cost-effective, providing a balance between performance and affordability.Application scenarios: 1. Internet of Things (IoT): The QG6311 chips can be used in IoT devices such as smart home appliances, wearable devices, and industrial sensors, where low power consumption and small form factor are crucial. 2. Wireless communication systems: These chips can be utilized in wireless communication systems like Bluetooth devices, Wi-Fi modules, and Zigbee networks, providing reliable and efficient connectivity. 3. Consumer electronics: The QG6311 chips can be integrated into smartphones, tablets, and other portable devices, enabling high-performance processing and connectivity features. 4. Industrial automation: These chips can be employed in industrial automation systems, including robotics, control systems, and monitoring devices, where low power consumption and high performance are essential. 5. Automotive electronics: The QG6311 chips can be used in automotive applications such as infotainment systems, advanced driver-assistance systems (ADAS), and vehicle-to-vehicle communication, providing reliable and efficient connectivity.Overall, the QG6311 integrated circuit chips offer advantages in terms of low power consumption, small form factor, high performance, versatility, and cost-effectiveness, making them suitable for various applications in IoT, wireless communication, consumer electronics, industrial automation, and automotive electronics.
CY91F525BSEPMC1-GS-ERE2 Relevant information