Home / Microcontrollers / CY91F467BAPMC-GS-W022/
CY91F467BAPMC-GS-W022

CY91F467BAPMC-GS-W022

Manufacturer No:

CY91F467BAPMC-GS-W022

Manufacturer:

Infineon Technologies

Description:

IC MCU 32BT 1.0625MB FLSH 144QFP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

CY91F467BAPMC-GS-W022 Specifications

  • Type
    Parameter
  • Supplier Device Package
    144-LQFP (20x20)
  • Package / Case
    144-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 32x10b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    40K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    1.0625MB (1.0625M x 8)
  • Number of I/O
    108
  • Peripherals
    DMA, LVD, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, I²C, LINbus, UART/USART
  • Speed
    96MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    FR60 RISC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    FR CY91460B
The SLE 66CX80PE MFC5.6 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Security: These chips are designed with advanced security features, including hardware-based encryption and authentication mechanisms, making them suitable for secure applications. 2. Contactless Interface: The chips support contactless communication using Near Field Communication (NFC) technology, enabling convenient and fast data exchange. 3. Memory Capacity: With a memory capacity of 80 kilobytes, these chips can store a significant amount of data, making them suitable for applications that require storage of large amounts of information. 4. Multi-Application Support: The chips are capable of supporting multiple applications simultaneously, allowing for the integration of various functionalities into a single chip. 5. Compliance: The SLE 66CX80PE MFC5.6 chips comply with industry standards and specifications, ensuring compatibility and interoperability with existing systems.Application Scenarios: 1. Access Control: These chips can be used in access control systems, such as building entry systems or secure areas, where secure authentication and identification are required. 2. Public Transport Ticketing: The chips can be utilized in contactless smart cards for public transport ticketing systems, enabling quick and secure fare payment and access control. 3. Identity Documents: The chips can be integrated into identity documents like passports or national ID cards, providing secure storage of personal information and enabling authentication. 4. Payment Systems: These chips can be used in contactless payment cards or mobile payment applications, allowing for secure and convenient transactions. 5. Loyalty Programs: The chips can be employed in loyalty cards or customer reward programs, enabling secure storage and retrieval of customer information and transaction history.Overall, the SLE 66CX80PE MFC5.6 integrated circuit chips offer high security, contactless communication, and multi-application support, making them suitable for various applications requiring secure data storage and communication.
CY91F467BAPMC-GS-W022 Relevant information