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CY91F469GBPB-GSER-270572

CY91F469GBPB-GSER-270572

Manufacturer No:

CY91F469GBPB-GSER-270572

Manufacturer:

Infineon Technologies

Description:

IC MCU 32BT 2.0625MB FLSH 320BGA

Datasheet:

Datasheet

Delivery:

Payment:

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CY91F469GBPB-GSER-270572 Specifications

  • Type
    Parameter
  • Supplier Device Package
    320-BGA (27x27)
  • Package / Case
    320-BBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    External, Internal
  • Data Converters
    A/D 32x10b SAR
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    96K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    2.0625MB (2.0625M x 8)
  • Number of I/O
    205
  • Peripherals
    DMA, LVD, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, I²C, LINbus, UART/USART
  • Speed
    100MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    FR60 RISC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    FR CY91460G
The FDC37C665DQFP is a type of integrated circuit chip that is commonly used in computer systems and peripherals. Some of the advantages and application scenarios of this chip are:1. Versatility: The FDC37C665DQFP chip is a multi-function I/O controller that provides a wide range of features and functions. It can be used in various applications, including desktop computers, laptops, servers, and embedded systems.2. Enhanced I/O capabilities: This chip offers a high number of I/O ports, including parallel ports, serial ports, floppy disk drive controllers, and keyboard/mouse controllers. It allows for efficient data transfer and communication between different devices.3. System integration: The FDC37C665DQFP chip integrates multiple functions into a single chip, reducing the need for additional components and simplifying the overall system design. It helps in reducing the size, cost, and complexity of the system.4. Compatibility: This chip is designed to be compatible with various industry standards, such as ISA (Industry Standard Architecture) and ACPI (Advanced Configuration and Power Interface). It ensures compatibility with a wide range of devices and peripherals.5. Power management: The FDC37C665DQFP chip includes power management features, such as sleep mode and power-saving modes. It helps in optimizing power consumption and extending the battery life of portable devices.6. Application scenarios: The FDC37C665DQFP chip is commonly used in computer motherboards, expansion cards, industrial control systems, and other devices that require I/O control and management. It is particularly useful in legacy systems that require support for older interfaces like parallel and serial ports.Overall, the FDC37C665DQFP chip offers a combination of versatility, enhanced I/O capabilities, system integration, and power management features, making it suitable for a wide range of applications in the computer and embedded systems industry.
CY91F469GBPB-GSER-270572 Relevant information