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CY91F469GBPB-GSER-270570

CY91F469GBPB-GSER-270570

Manufacturer No:

CY91F469GBPB-GSER-270570

Manufacturer:

Infineon Technologies

Description:

IC MCU 32BT 2.0625MB FLSH 320BGA

Datasheet:

Datasheet

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CY91F469GBPB-GSER-270570 Specifications

  • Type
    Parameter
  • Supplier Device Package
    320-BGA (27x27)
  • Package / Case
    320-BBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    External, Internal
  • Data Converters
    A/D 32x10b SAR
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    96K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    2.0625MB (2.0625M x 8)
  • Number of I/O
    205
  • Peripherals
    DMA, LVD, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, I²C, LINbus, UART/USART
  • Speed
    100MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    FR60 RISC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    FR CY91460G
The LPC1778FBD144,551 is a microcontroller chip manufactured by NXP Semiconductors. It belongs to the LPC1700 series and offers several advantages and application scenarios:Advantages: 1. High-performance: The LPC1778FBD144,551 is based on the ARM Cortex-M3 core, which provides a high level of processing power and performance. 2. Large memory: It has a large on-chip flash memory of 512 KB and a RAM of 96 KB, allowing for the storage and execution of complex applications. 3. Connectivity options: The chip supports various communication interfaces such as USB, Ethernet, CAN, UART, SPI, and I2C, enabling seamless connectivity with other devices and networks. 4. Rich peripheral set: It offers a wide range of peripherals including timers, PWM channels, ADCs, DACs, GPIOs, and more, allowing for versatile application development. 5. Low power consumption: The LPC1778FBD144,551 is designed to be power-efficient, making it suitable for battery-powered applications or devices that require low power consumption.Application scenarios: 1. Industrial automation: The chip's high-performance capabilities, connectivity options, and rich peripheral set make it suitable for industrial automation applications such as motor control, robotics, and process control systems. 2. Internet of Things (IoT): With its connectivity features, the LPC1778FBD144,551 can be used in IoT devices to enable communication and data exchange with other devices or cloud platforms. 3. Consumer electronics: The chip's processing power, memory, and peripherals make it suitable for various consumer electronics applications like home automation, smart appliances, and wearable devices. 4. Automotive: The LPC1778FBD144,551 can be used in automotive applications such as engine control units (ECUs), dashboard systems, and infotainment systems, thanks to its connectivity options and robust performance. 5. Medical devices: Its low power consumption, connectivity, and processing capabilities make it suitable for medical devices like patient monitoring systems, portable medical devices, and diagnostic equipment.These are just a few examples of the advantages and application scenarios of the LPC1778FBD144,551. The versatility and capabilities of the chip make it suitable for a wide range of embedded system applications.
CY91F469GBPB-GSER-270570 Relevant information