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ST92F150JDV1QCE

ST92F150JDV1QCE

Manufacturer No:

ST92F150JDV1QCE

Manufacturer:

STMicroelectronics

Description:

IC MCU 8/16BIT 128KB FLSH 100QFP

Datasheet:

Datasheet

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ST92F150JDV1QCE Specifications

  • Type
    Parameter
  • Supplier Device Package
    100-PQFP (14x20)
  • Package / Case
    100-BQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 16x10b
  • Voltage - Supply (Vcc/Vdd)
    4.5V ~ 5.5V
  • RAM Size
    6K x 8
  • EEPROM Size
    1K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    128KB (128K x 8)
  • Number of I/O
    77
  • Peripherals
    DMA, LVD, PWM, WDT
  • Connectivity
    CANbus, I²C, SCI, SPI
  • Speed
    24MHz
  • Core Size
    8/16-Bit
  • Core Processor
    ST9
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    ST9
The MPC8360EZUAGDG is a highly integrated system-on-chip (SoC) designed by NXP Semiconductors. It belongs to the PowerQUICC II Pro family and offers several advantages and application scenarios:Advantages: 1. High Performance: The MPC8360EZUAGDG features a Power Architecture e300 core running at up to 667 MHz, providing excellent processing power for various applications. 2. Integrated Peripherals: It includes a wide range of integrated peripherals such as Ethernet controllers, USB ports, UARTs, I2C, SPI, and more, reducing the need for additional external components. 3. Security Features: The chip incorporates security features like secure boot, tamper detection, and cryptographic acceleration, making it suitable for applications requiring data protection. 4. Power Efficiency: The SoC is designed to be power-efficient, enabling longer battery life in portable devices and reducing overall power consumption in various applications. 5. Scalability: The MPC8360EZUAGDG offers scalability options, allowing it to be used in a wide range of applications, from small embedded systems to more complex networking devices.Application Scenarios: 1. Networking Equipment: The MPC8360EZUAGDG is commonly used in networking equipment such as routers, switches, and gateways. Its high-performance processing capabilities and integrated Ethernet controllers make it suitable for these applications. 2. Industrial Automation: The chip's robustness, security features, and support for various communication protocols make it ideal for industrial automation applications. It can be used in programmable logic controllers (PLCs), motor control systems, and other industrial control devices. 3. Telecommunications: The MPC8360EZUAGDG can be utilized in telecommunications equipment like base stations, media gateways, and voice-over-IP (VoIP) systems. Its integrated peripherals and high-performance processing enable efficient data handling and communication. 4. Automotive: The chip's power efficiency, security features, and support for automotive communication protocols make it suitable for automotive applications. It can be used in advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs). 5. Embedded Systems: The MPC8360EZUAGDG can be employed in various embedded systems, including smart appliances, medical devices, and consumer electronics. Its integration of multiple peripherals and processing power make it versatile for different applications.Overall, the MPC8360EZUAGDG integrated circuit chips offer high performance, integrated peripherals, security features, scalability, and power efficiency, making them suitable for a wide range of applications in networking, industrial automation, telecommunications, automotive, and embedded systems.
ST92F150JDV1QCE Relevant information