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R5F10PMGLFB#X5

R5F10PMGLFB#X5

Manufacturer No:

R5F10PMGLFB#X5

Description:

IC MCU 16BIT LFQFP

Datasheet:

Datasheet

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R5F10PMGLFB#X5 Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Oscillator Type
    -
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    -
  • RAM Size
    -
  • EEPROM Size
    -
  • Program Memory Type
    -
  • Program Memory Size
    -
  • Peripherals
    -
  • Connectivity
    -
  • Speed
    -
  • Core Size
    -
  • Core Processor
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The MPC8360ECVVAGDG is a highly integrated system-on-chip (SoC) designed by NXP Semiconductors. It belongs to the PowerQUICC II Pro family and offers several advantages and application scenarios:Advantages: 1. High Performance: The MPC8360ECVVAGDG features a Power Architecture e300 core running at up to 667 MHz, providing excellent processing power for various applications. 2. Integrated Peripherals: It includes a wide range of integrated peripherals such as Ethernet controllers, USB ports, UARTs, I2C, SPI, and more, reducing the need for additional external components. 3. Security Features: The chip incorporates security features like secure boot, tamper detection, and cryptographic acceleration, making it suitable for applications requiring data protection. 4. Power Efficiency: The SoC is designed to be power-efficient, enabling longer battery life and reducing overall power consumption. 5. Scalability: The MPC8360ECVVAGDG offers scalability options, allowing it to be used in a variety of applications with different performance and feature requirements.Application Scenarios: 1. Networking Equipment: The integrated Ethernet controllers and high-performance processing capabilities make the MPC8360ECVVAGDG suitable for networking equipment such as routers, switches, and gateways. 2. Industrial Automation: The SoC's robustness, security features, and support for various communication protocols make it ideal for industrial automation applications like programmable logic controllers (PLCs) and industrial gateways. 3. Telecommunications: The chip's high-speed processing, integrated peripherals, and support for various communication interfaces make it suitable for telecommunications applications like base stations, media gateways, and voice-over-IP (VoIP) systems. 4. Automotive: The MPC8360ECVVAGDG can be used in automotive applications such as infotainment systems, advanced driver-assistance systems (ADAS), and telematics due to its processing power, connectivity options, and security features. 5. Embedded Systems: The SoC's integration of various peripherals, power efficiency, and scalability make it suitable for a wide range of embedded systems, including industrial control systems, medical devices, and consumer electronics.It's important to note that the specific application scenarios may vary depending on the requirements and customization of the chip for a particular use case.
R5F10PMGLFB#X5 Relevant information