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R7F701403EAFB#AA0

R7F701403EAFB#AA0

Manufacturer No:

R7F701403EAFB#AA0

Description:

IC MCU 32BIT 4MB FLASH 176LFQFP

Datasheet:

Datasheet

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R7F701403EAFB#AA0 Specifications

  • Type
    Parameter
  • Supplier Device Package
    176-LFQFP (24x24)
  • Package / Case
    176-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 150°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 16x12b
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 5.5V
  • RAM Size
    512K x 8
  • EEPROM Size
    64K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    4MB (4M x 8)
  • Number of I/O
    126
  • Peripherals
    DMA, I²S, LCD, LVD, POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB
  • Speed
    120MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    RH850G3M
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    RH850/D1L
The MB89663PF-GT-198-BNDE1 is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89663PF-GT-198-BNDE1 chip is designed to deliver high performance with a fast processing speed, making it suitable for applications that require quick data processing and response times. 2. Low Power Consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Integrated Peripherals: The chip comes with various integrated peripherals such as UART, I2C, SPI, timers, and PWM channels, which can simplify the design and reduce the need for external components. 4. Rich Memory Options: The chip offers a range of memory options, including Flash memory and RAM, allowing for flexible storage and data handling capabilities. 5. Robust Connectivity: It supports various communication interfaces like USB, CAN, and LIN, enabling seamless connectivity with other devices or systems.Application Scenarios: 1. Industrial Automation: The high performance and integrated peripherals of this chip make it suitable for industrial automation applications, such as motor control, robotics, and process control systems. 2. Internet of Things (IoT): With its low power consumption and connectivity options, this chip can be used in IoT devices like smart home automation systems, wearable devices, or sensor nodes. 3. Automotive Electronics: The chip's robust connectivity options, along with its ability to handle real-time data processing, make it suitable for automotive applications like engine control units, dashboard systems, or vehicle communication systems. 4. Consumer Electronics: The chip's high performance and integrated peripherals can be utilized in various consumer electronics applications, including gaming consoles, multimedia devices, or home entertainment systems. 5. Medical Devices: The low power consumption and processing capabilities of this chip can be beneficial for medical devices like patient monitoring systems, portable medical instruments, or diagnostic equipment.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to consult the datasheet and technical documentation provided by the manufacturer for detailed information and suitability for specific applications.
R7F701403EAFB#AA0 Relevant information