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R5F10DLEJFB#X6

R5F10DLEJFB#X6

Manufacturer No:

R5F10DLEJFB#X6

Description:

IC MCU 16BIT LFQFP

Datasheet:

Datasheet

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R5F10DLEJFB#X6 Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Oscillator Type
    -
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    -
  • RAM Size
    -
  • EEPROM Size
    -
  • Program Memory Type
    -
  • Program Memory Size
    -
  • Peripherals
    -
  • Connectivity
    -
  • Speed
    -
  • Core Size
    -
  • Core Processor
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The MAX350EWN+ integrated circuit chips offer several advantages and can be used in various application scenarios. Here are some of the advantages and application scenarios:Advantages: 1. High Integration: The MAX350EWN+ is a highly integrated chip that combines a power amplifier, quadrature modulator, and up-converter into a single package. This integration saves board space and reduces the complexity of the overall design.2. Wide Frequency Range: The chip operates in a wide frequency range, making it suitable for a variety of wireless communication applications.3. Low Power Consumption: The MAX350EWN+ is designed to be power-efficient, which is essential for battery-powered devices and applications where power consumption needs to be minimized.4. High Output Power: The chip provides a high output power, ensuring strong and reliable signals in wireless communication systems.Application Scenarios: 1. Wireless Communication Systems: The MAX350EWN+ can be used in wireless communication systems such as cellular networks, wireless local area networks (WLANs), Bluetooth, and other wireless protocols. It enables the transmission of signals at high power levels, improving the range and reliability of wireless communication.2. Internet of Things (IoT): With the rise of IoT devices and applications, the MAX350EWN+ can be utilized in IoT systems to enable wireless connectivity and communication. It can be used in IoT gateways, sensor networks, and smart home devices to transmit and receive data over wireless channels.3. Satellite Communication: The chip can be employed in satellite communication systems to amplify the signals before transmitting them to the satellite. Its high output power capability ensures reliable communication over long distances.4. Radio Frequency (RF) Transmitters: The MAX350EWN+ is suitable for RF transmitter applications where modulated signals need to be amplified and up-converted to the desired frequency. This includes applications such as radio broadcasting, remote control systems, and wireless audio/video transmission.5. Test and Measurement Equipment: The chip can be integrated into test and measurement equipment, such as signal generators or signal analyzers, to provide high-quality RF signals or to amplify weak signals for analysis purposes.Overall, the MAX350EWN+ integrated circuit chips offer advantages such as high integration, wide frequency range, low power consumption, and high output power, making them versatile for wireless communication applications across various industries.
R5F10DLEJFB#X6 Relevant information