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R5F56217BNLE#U0

R5F56217BNLE#U0

Manufacturer No:

R5F56217BNLE#U0

Description:

IC MCU 32BIT 384KB FLASH 145LGA

Datasheet:

Datasheet

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R5F56217BNLE#U0 Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Oscillator Type
    -
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    -
  • RAM Size
    -
  • EEPROM Size
    -
  • Program Memory Type
    -
  • Program Memory Size
    -
  • Peripherals
    -
  • Connectivity
    -
  • Speed
    -
  • Core Size
    -
  • Core Processor
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The P1017NSN5CFB is a specific model of integrated circuit chip manufactured by NXP Semiconductors. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The P1017NSN5CFB chip is designed to deliver high-performance processing capabilities, making it suitable for demanding applications. 2. Power Efficiency: It is designed to be power-efficient, helping to reduce energy consumption and extend battery life in portable devices. 3. Scalability: The chip offers scalability options, allowing it to be used in a wide range of applications with varying processing requirements. 4. Security Features: It may include built-in security features to enhance data protection and prevent unauthorized access. 5. Connectivity: The chip may support various connectivity options, such as Ethernet, USB, and PCIe, enabling seamless integration with other devices and networks.Application Scenarios: 1. Networking Equipment: The P1017NSN5CFB chip can be used in networking equipment like routers, switches, and gateways, where high-performance processing and connectivity are crucial. 2. Industrial Automation: It can be employed in industrial automation systems, providing the necessary processing power and connectivity for real-time control and monitoring. 3. Internet of Things (IoT): The chip can be utilized in IoT devices, enabling them to process data locally, communicate with other devices, and connect to the internet. 4. Edge Computing: With its high-performance capabilities, the chip can be used in edge computing applications, where data processing is performed closer to the data source, reducing latency and improving efficiency. 5. Embedded Systems: The chip can be integrated into various embedded systems, such as automotive electronics, medical devices, and consumer electronics, to provide processing power and connectivity.It's important to note that the specific advantages and application scenarios may vary depending on the actual implementation and the requirements of the target system.
R5F56217BNLE#U0 Relevant information