Home / Microcontrollers / CY9BF306NBGL-GE1/
CY9BF306NBGL-GE1

CY9BF306NBGL-GE1

Manufacturer No:

CY9BF306NBGL-GE1

Manufacturer:

Infineon Technologies

Description:

IC MEM MM MCU PBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

CY9BF306NBGL-GE1 Specifications

  • Type
    Parameter
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The XCZU9EG-3FFVC900E is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios:Advantages: 1. High Performance: The XCZU9EG-3FFVC900E chip is built on the UltraScale+ architecture, which combines programmable logic with processing units. It offers high-performance processing capabilities, making it suitable for demanding applications. 2. Programmability: Being an FPGA (Field-Programmable Gate Array) chip, it allows for reprogramming and customization of the hardware functionality. This flexibility is advantageous for applications that require frequent updates or specific hardware acceleration. 3. Integration: The XCZU9EG-3FFVC900E chip integrates multiple processing units, including ARM Cortex-A53 cores, ARM Cortex-R5 cores, and programmable logic. This integration enables the chip to handle complex tasks efficiently and effectively. 4. Power Efficiency: The chip is designed to optimize power consumption, making it suitable for applications where power efficiency is crucial. 5. Versatility: With its combination of processing units and programmable logic, the XCZU9EG-3FFVC900E chip can be used in a wide range of applications, from embedded systems to high-performance computing.Application Scenarios: 1. Embedded Systems: The XCZU9EG-3FFVC900E chip can be used in various embedded systems, such as industrial automation, robotics, and automotive applications. Its high-performance processing units and programmable logic enable efficient control and customization of hardware functionality. 2. Video and Image Processing: The chip's processing capabilities make it suitable for video and image processing applications, including real-time video analytics, computer vision, and high-definition video encoding/decoding. 3. Networking and Communication: The XCZU9EG-3FFVC900E chip can be utilized in networking and communication systems, such as routers, switches, and base stations. Its high-performance processing units and programmable logic enable efficient data processing and protocol handling. 4. Aerospace and Defense: The chip's power efficiency and high-performance processing make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems. 5. Data Centers: The XCZU9EG-3FFVC900E chip can be used in data centers for tasks like acceleration of machine learning algorithms, data compression, and encryption/decryption.These are just a few examples of the advantages and application scenarios of the XCZU9EG-3FFVC900E chip. The versatility and performance of the chip make it suitable for a wide range of applications where high-performance processing and programmability are required.
CY9BF306NBGL-GE1 Relevant information