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MC100ES6226FA

MC100ES6226FA

Manufacturer No:

MC100ES6226FA

Manufacturer:

NXP USA Inc.

Description:

IC CLK BUFFER 1:9 3GHZ 32TQFP

Datasheet:

Datasheet

Delivery:

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MC100ES6226FA Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-TQFP (7x7)
  • Mounting Type
    Surface Mount
  • Differential - Input:Output
    Yes/Yes
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tray
  • Series
    100ES
The MC100ES6226FA is a high-speed, low-voltage differential signaling (LVDS) integrated circuit chip. It offers several advantages and can be applied in various scenarios. Here are some of its advantages and application scenarios:Advantages: 1. High-speed data transmission: The MC100ES6226FA supports data rates up to 3.2 Gbps, making it suitable for high-speed communication applications. 2. Low power consumption: It operates at low voltage levels, resulting in lower power consumption compared to other signaling technologies. 3. Noise immunity: LVDS technology provides excellent noise immunity, allowing reliable data transmission even in noisy environments. 4. Scalability: The chip can be easily cascaded with other LVDS devices, enabling the creation of larger systems with multiple channels. 5. Small form factor: The MC100ES6226FA is available in a compact package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The chip can be used in applications that require high-speed data transmission, such as telecommunications, networking, and data centers. 2. Video transmission: LVDS technology is commonly used for transmitting high-resolution video signals. The MC100ES6226FA can be employed in video interfaces for displays, projectors, and video walls. 3. Industrial automation: The chip's noise immunity and high-speed capabilities make it suitable for industrial automation applications, including robotics, machine vision, and control systems. 4. Test and measurement equipment: The MC100ES6226FA can be utilized in test and measurement equipment that requires high-speed data acquisition and transmission. 5. Medical imaging: LVDS technology is often used in medical imaging devices like ultrasound machines and MRI scanners. The chip can be integrated into these systems for high-speed data transfer.It's important to note that the specific application scenarios may vary depending on the system requirements and design considerations.
MC100ES6226FA Relevant information