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MC100ES6111FA

MC100ES6111FA

Manufacturer No:

MC100ES6111FA

Manufacturer:

NXP USA Inc.

Description:

IC CLK BUFFER 2:10 2.7GHZ 32LQFP

Datasheet:

Datasheet

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MC100ES6111FA Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-LQFP (7x7)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 110°C
  • Output
    ECL, PECL
  • Differential - Input:Output
    Yes/Yes
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tray
  • Series
    100ES
The MC100ES6111FA is a high-speed, low-voltage differential signaling (LVDS) driver and receiver integrated circuit chip. It offers several advantages and can be applied in various scenarios, including:1. High-speed data transmission: The MC100ES6111FA supports data rates up to 3.2 Gbps, making it suitable for applications requiring fast and reliable data transmission. It can be used in high-speed communication systems, such as telecommunications, networking, and data centers.2. Low power consumption: This chip operates at low voltage levels (typically 2.5V), resulting in lower power consumption compared to other signaling technologies. It is ideal for battery-powered devices or applications where power efficiency is crucial.3. Noise immunity: LVDS technology provides excellent noise immunity, allowing the MC100ES6111FA to operate reliably in noisy environments. It can be used in industrial settings or applications where electromagnetic interference (EMI) is a concern.4. Long-distance transmission: LVDS signaling enables long-distance transmission without significant signal degradation. The MC100ES6111FA can be used in applications that require data transmission over extended distances, such as video surveillance systems or digital signage.5. Clock distribution: The chip's differential inputs and outputs make it suitable for clock distribution applications. It can be used to distribute high-frequency clock signals in systems that require precise synchronization, such as test and measurement equipment or high-performance computing.6. Backplane communication: The MC100ES6111FA can be used in backplane communication systems, where multiple boards or modules need to exchange data. Its high-speed capabilities and noise immunity make it suitable for high-speed backplane designs.Overall, the MC100ES6111FA integrated circuit chip offers advantages such as high-speed data transmission, low power consumption, noise immunity, long-distance transmission, clock distribution, and backplane communication. Its applications range from telecommunications and networking to industrial automation and high-performance computing.
MC100ES6111FA Relevant information